XCV50E-8FG256C
- Mfr.Part #
- XCV50E-8FG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC FPGA 176 I/O 256FBGA
- Stock
- 8,773
- In Stock :
- 8,773
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Peak Reflow Temperature (Cel) :
- 225
- Base Part Number :
- XCV50E
- Pin Count :
- 256
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Operating Temperature :
- 0°C~85°C TJ
- Mounting Type :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Combinatorial Delay of a CLB-Max :
- 0.4 ns
- Number of CLBs :
- 384
- JESD-609 Code :
- e0
- Radiation Hardening :
- No
- Packaging :
- Tray
- Total RAM Bits :
- 65536
- Length :
- 17mm
- Width :
- 17mm
- Clock Frequency :
- 416MHz
- Height Seated (Max) :
- 2mm
- Published :
- 2006
- Pbfree Code :
- No
- Supply Voltage :
- 1.8V
- Number of LABs/CLBs :
- 384
- Lead Free :
- Contains Lead
- Number of Terminations :
- 256
- Operating Supply Voltage :
- 1.8V
- Number of Gates :
- 71693
- Voltage - Supply :
- 1.71V~1.89V
- Speed Grade :
- 8
- Series :
- Virtex®-E
- Terminal Position :
- BOTTOM
- Mount :
- Surface Mount
- Number of Pins :
- 256
- RoHS Status :
- Non-RoHS Compliant
- Terminal Form :
- Ball
- Package / Case :
- 256-BGA
- Number of Outputs :
- 176
- ECCN Code :
- EAR99
- RAM Size :
- 8kB
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells :
- 1728
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Terminal Pitch :
- 1mm
- Number of I/O :
- 176
- Number of Equivalent Gates :
- 20736
- Datasheets
- XCV50E-8FG256C

FPGAs AMD Xilinx XCV50E-8FG256C Overview
The FPGAs AMD Xilinx XCV50E-8FG256C is a highly versatile and efficient Field Programmable Gate Array (FPGA) designed to meet the robust needs of modern digital applications. Manufactured by AMD Xilinx, this FPGA stands out with its ability to facilitate rapid prototyping and diverse customization options. The XCV50E-8FG256C is built on a platform that supports a wide array of functionalities, making it ideal for designers looking to push the limits of hardware acceleration and digital signal processing. Its compact 256FBGA (Fine Pitch Ball Grid Array) packaging ensures a minimal footprint while providing a generous count of 176 I/O pins for expansive connectivity options.
XCV50E-8FG256C Features
This FPGA model excels in delivering high-performance computing capabilities with low power consumption, which is crucial for today's energy-sensitive applications. The XCV50E-8FG256C facilitates complex logic operations and supports multiple I/O standards, enhancing its adaptability across various platforms. With its advanced security features, it ensures safe data processing, making it a reliable choice for critical applications in industry and commerce.
XCV50E-8FG256C Applications
- Telecommunications: Utilized in communication infrastructure to enhance signal processing and network reliability.
- Automotive Electronics: Deployed in advanced driver-assistance systems (ADAS) to process real-time sensory data and enhance vehicle safety.
- Consumer Electronics: Integrated into smart home devices to manage complex user interfaces and connectivity solutions.
- Industrial Automation: Used in control systems to execute complex algorithms that drive automation in manufacturing processes.
- Aerospace and Defense: Applied in navigation and control systems to perform robust data processing under challenging environmental conditions.
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