XCV50E-6CS144I

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Mfr.Part #
XCV50E-6CS144I
Manufacturer
AMD Xilinx
Package / Case
144-TFBGA, CSPBGA
Datasheet
Download
Description
IC FPGA 94 I/O 144CSBGA
Stock
36,418
In Stock :
36,418

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of LABs/CLBs :
384
HTS Code :
8542.39.00.01
Number of Outputs :
94
Width :
12mm
Combinatorial Delay of a CLB-Max :
0.47 ns
Lead Free :
Contains Lead
Voltage - Supply :
1.71V~1.89V
Total RAM Bits :
65536
JESD-609 Code :
e0
Operating Supply Voltage :
1.8V
Number of CLBs :
384
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Terminations :
144
Number of Logic Elements/Cells :
1728
Number of Gates :
71693
Radiation Hardening :
No
Supply Voltage :
1.8V
Mounting Type :
Surface Mount
Number of Pins :
144
Clock Frequency :
357MHz
RAM Size :
8kB
Speed Grade :
6
Number of I/O :
94
Packaging :
Tray
Height Seated (Max) :
1.2mm
RoHS Status :
Non-RoHS Compliant
Pin Count :
144
Package / Case :
144-TFBGA, CSPBGA
Terminal Position :
BOTTOM
Base Part Number :
XCV50E
Peak Reflow Temperature (Cel) :
240
Published :
2013
Series :
Virtex®-E
Pbfree Code :
No
Length :
12mm
Time@Peak Reflow Temperature-Max (s) :
30
Terminal Form :
Ball
Mount :
Surface Mount
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Pitch :
0.8mm
ECCN Code :
EAR99
Operating Temperature :
-40°C~100°C TJ
Datasheets
XCV50E-6CS144I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV50E-6CS144I from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:144, Mounting Type:Surface Mount, Number of Pins:144, Package / Case:144-TFBGA, CSPBGA, Base Part Number:XCV50E, Operating Temperature:-40°C~100°C TJ, XCV50E-6CS144I pinout, XCV50E-6CS144I datasheet PDF, XCV50E-6CS144I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV50E-6CS144I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.8V V 1.2mm mm FPGAs Virtex®-E Series 144-TFBGA, CSPBGA 0.8mm mm 144

XCV50E-6CS144I Overview


In the package 144-TFBGA, CSPBGA, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 94 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 1728 logic elements/cells. Supply voltage is 1.8V volts. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 1.71V~1.89V, this device operates with ease. This is a type of FPGA that is part of the Virtex®-E series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. In this device, 94 outputs are incorporated in order to provide you with maximum flexibility. As a result of space limitations, this FPGA model has been included in Tray. In total, the terminations of this piece are 144. Fpga electronics is worth mentioning that this device provides 65536 bfpga electronics s of RAM. XCV50E is the base part number that can be used to identify related parts. The RAM si8kBe of this FPGA module reaches 8kB so as to guarantee the normal operation of the program during operation. The device has 144 pins which are included in the design. The FPGA is built as an array of 384 latches or CLBs. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. In operation with 1.8V, designers can take advantage of its flexibility to the fullest extent. A basic building block for this type of building block consists of 71693 gates. I am going to present you with a device that is equipped with 144 pins. Fpga semiconductor typically uses a crystal oscillating at 357MHz. The architecture of the system is based on 384 CLBs.

XCV50E-6CS144I Features


94 I/Os
Up to 65536 RAM bits
144 LABs/CLBs


XCV50E-6CS144I Applications


There are a lot of Xilinx Inc.
XCV50E-6CS144I FPGAs applications.


  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
  • Data Center
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