XCV50-6BG256C
- Mfr.Part #
- XCV50-6BG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-BBGA
- Datasheet
- Download
- Description
- IC FPGA 180 I/O 256BGA
- Stock
- 25,994
- In Stock :
- 25,994
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Packaging :
- Tray
- Published :
- 2000
- Number of I/O :
- 180
- Supply Voltage :
- 2.5V
- Terminal Pitch :
- 1.27mm
- Mount :
- Surface Mount
- Height Seated (Max) :
- 2.55mm
- Terminal Form :
- Ball
- Total RAM Bits :
- 32768
- Number of Gates :
- 57906
- Combinatorial Delay of a CLB-Max :
- 0.6 ns
- Pin Count :
- 256
- Number of Terminations :
- 256
- Base Part Number :
- XCV50
- ECCN Code :
- EAR99
- Qualification Status :
- Not Qualified
- Lead Free :
- Contains Lead
- Width :
- 27mm
- HTS Code :
- 8542.39.00.01
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel) :
- 225
- Clock Frequency :
- 333MHz
- Power Supplies :
- 1.2/3.62.5V
- Pbfree Code :
- No
- Package / Case :
- 256-BBGA
- Number of CLBs :
- 384
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Length :
- 27mm
- Voltage - Supply :
- 2.375V~2.625V
- Number of Logic Elements/Cells :
- 1728
- Reach Compliance Code :
- not_compliant
- RoHS Status :
- Non-RoHS Compliant
- Number of LABs/CLBs :
- 384
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Series :
- Virtex®
- Mounting Type :
- Surface Mount
- Terminal Position :
- BOTTOM
- Operating Temperature :
- 0°C~85°C TJ
- RAM Size :
- 4kB
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of Pins :
- 256
- JESD-609 Code :
- e0
- Number of Outputs :
- 180
- Datasheets
- XCV50-6BG256C
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FPGAs AMD Xilinx XCV50-6BG256C Overview
The FPGAs AMD Xilinx XCV50-6BG256C is a highly capable integrated circuit from AMD Xilinx, designed for versatility and high performance in a variety of complex digital computing environments. This FPGA (Field Programmable Gate Array) is crafted to support rapid prototyping and flexible design adaptations, making it an indispensable tool for engineers and developers aiming to push the boundaries of technological innovation. Its compact 256-ball grid array (BGA) packaging ensures a minimal footprint on system boards, thus optimizing the overall design space and enhancing system reliability.
XCV50-6BG256C Features
This FPGA features 180 user I/O pins, allowing for extensive connectivity and interfacing with a wide range of peripheral devices. The device is tailored to meet the demanding requirements of high-speed digital processing, providing a robust platform for developing sophisticated multi-functional devices. Its configuration is optimized for a cost-effective integration into system-on-chip (SoC) solutions, making it a preferred choice for developers looking to maximize functionality while minimizing costs.
XCV50-6BG256C Applications
- Telecommunications: Utilized in communication infrastructure to facilitate complex signal processing tasks, improving bandwidth and data transmission capabilities.
- Automotive Electronics: Integrated into automotive systems for handling advanced driver-assistance systems (ADAS), ensuring higher safety and better vehicle control.
- Consumer Electronics: Employed in devices such as high-performance gaming consoles and smart home systems, enhancing processing power and user experience.
- Industrial Automation: Used in control systems for manufacturing lines, improving automation efficiency and reliability through sophisticated control algorithms.
- Medical Devices: Essential in the development of medical imaging systems, enabling complex data analysis and real-time processing for better diagnostic tools.
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