XCV150-5BG256C
- Mfr.Part #
- XCV150-5BG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-BBGA
- Datasheet
- Download
- Description
- IC FPGA 180 I/O 256BGA
- Stock
- 21,659
- In Stock :
- 21,659
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Power Supplies :
- 1.2/3.62.5V
- Operating Temperature :
- 0°C~85°C TJ
- Lead Free :
- Contains Lead
- Qualification Status :
- Not Qualified
- Height Seated (Max) :
- 2.55mm
- Packaging :
- Tray
- Number of CLBs :
- 864
- Terminal Position :
- BOTTOM
- RoHS Status :
- Non-RoHS Compliant
- Pbfree Code :
- No
- Pin Count :
- 256
- Number of LABs/CLBs :
- 864
- Terminal Pitch :
- 1.27mm
- Number of I/O :
- 180
- Mount :
- Surface Mount
- Series :
- Virtex®
- RAM Size :
- 6kB
- Number of Logic Elements/Cells :
- 3888
- Number of Outputs :
- 180
- Package / Case :
- 256-BBGA
- Width :
- 27mm
- Total RAM Bits :
- 49152
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- JESD-609 Code :
- e0
- Number of Pins :
- 256
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Terminations :
- 256
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Voltage - Supply :
- 2.375V~2.625V
- Base Part Number :
- XCV150
- Length :
- 27mm
- HTS Code :
- 8542.39.00.01
- Published :
- 2002
- Terminal Form :
- Ball
- ECCN Code :
- EAR99
- Mounting Type :
- Surface Mount
- Supply Voltage :
- 2.5V
- Number of Gates :
- 164674
- Reach Compliance Code :
- not_compliant
- Clock Frequency :
- 294MHz
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Combinatorial Delay of a CLB-Max :
- 0.7 ns
- Peak Reflow Temperature (Cel) :
- 225
- Datasheets
- XCV150-5BG256C
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FPGAs AMD Xilinx XCV150-5BG256C Overview
The FPGAs AMD Xilinx XCV150-5BG256C is a highly versatile field-programmable gate array (FPGA) that meets the modern demands of high-speed digital processing. Designed and manufactured by AMD Xilinx, a leader in digital circuit technology, this FPGA is built to handle complex, resource-intensive tasks efficiently. With its 256-ball grid array (BGA) packaging, the XCV150-5BG256C offers a robust platform for developing various applications requiring a high degree of integration and performance. Its adaptability makes it an ideal choice for designers looking to push the boundaries of technological innovation in multiple industries.
XCV150-5BG256C Features
This FPGA boasts 180 user I/O ports, enabling extensive connectivity and flexibility in system design. Its BGA packaging enhances thermal management and minimizes the footprint on the PCB, which is crucial for compact and dense hardware layouts. The XCV150-5BG256C supports a range of logic optimization features, making it suitable for a wide array of digital signal processing applications and enabling efficient power management across varied operational states.
XCV150-5BG256C Applications
- Telecommunications: Utilized in signal processing equipment, the XCV150-5BG256C enhances data transmission capabilities and network reliability by managing multiple data streams efficiently.
- Automotive: Integral in driver assistance systems, this FPGA processes real-time sensor data, supporting functionalities such as collision avoidance and traffic management.
- Consumer Electronics: In high-definition video devices, the XCV150-5BG256C allows for smooth rendering and processing of visual content, thereby elevating the user experience with rapid data handling and display technologies.
- Industrial Automation: This FPGA is key in control systems where real-time data processing and machine-to-machine communication are required for automated manufacturing processes.
- Medical Devices: Applied in diagnostic and imaging equipment, the XCV150-5BG256C ensures precise control and rapid processing capabilities necessary for critical healthcare applications.
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