XCV100E-6FG256C
- Mfr.Part #
- XCV100E-6FG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC FPGA 176 I/O 256FBGA
- Stock
- 21,561
- In Stock :
- 21,561
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Pins :
- 256
- Supply Voltage :
- 1.8V
- Terminal Position :
- BOTTOM
- Width :
- 17mm
- RAM Size :
- 10kB
- Number of I/O :
- 176
- Height Seated (Max) :
- 2mm
- Radiation Hardening :
- No
- Pbfree Code :
- No
- Number of Gates :
- 128236
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Packaging :
- Tray
- Voltage - Supply :
- 1.71V~1.89V
- RoHS Status :
- Non-RoHS Compliant
- Number of LABs/CLBs :
- 600
- Mount :
- Surface Mount
- Length :
- 17mm
- Number of Equivalent Gates :
- 32400
- Package / Case :
- 256-BGA
- Number of Terminations :
- 256
- Mounting Type :
- Surface Mount
- Lead Free :
- Contains Lead
- Number of Outputs :
- 176
- JESD-609 Code :
- e0
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of CLBs :
- 600
- ECCN Code :
- EAR99
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Base Part Number :
- XCV100E
- HTS Code :
- 8542.39.00.01
- Operating Temperature :
- 0°C~85°C TJ
- Pin Count :
- 256
- Number of Logic Elements/Cells :
- 2700
- Series :
- Virtex®-E
- Combinatorial Delay of a CLB-Max :
- 0.47 ns
- Operating Supply Voltage :
- 1.8V
- Terminal Form :
- Ball
- Speed Grade :
- 6
- Total RAM Bits :
- 81920
- Terminal Pitch :
- 1mm
- Published :
- 2003
- Clock Frequency :
- 357MHz
- Peak Reflow Temperature (Cel) :
- 225
- Datasheets
- XCV100E-6FG256C

FPGAs AMD Xilinx XCV100E-6FG256C Overview
The FPGAs AMD Xilinx XCV100E-6FG256C is a highly capable field programmable gate array (FPGA) that offers robust solutions for a variety of complex digital and logic circuit designs. This component, manufactured by AMD Xilinx, stands out for its versatility and high-performance capabilities, making it an ideal choice for designers looking to leverage speed and efficiency in their hardware implementations. With its substantial array of 176 I/O pins housed in a compact 256FBGA package, the XCV100E-6FG256C is designed to meet the rigorous demands of modern electronic environments, ensuring optimal functionality and scalability.
XCV100E-6FG256C Features
The XCV100E-6FG256C FPGA includes several features that enhance its usability and functionality in complex electronic designs. Key features include a high I/O pin count, a dense 256FBGA packaging, and a configuration that supports multiple logic design implementations, providing a flexible platform for hardware developers. The device's robust architecture allows for efficient heat dissipation and improved signal integrity, which are crucial for maintaining performance under intensive operational conditions.
XCV100E-6FG256C Applications
- Data Processing Units: Utilized in servers and high-performance computing systems to manage and process large datasets efficiently.
- Telecommunications: Employed in communication infrastructure to support complex signal processing tasks essential for modern telecommunications.
- Automotive Electronics: Integrated into automotive systems for managing vehicle dynamics and safety-related functionalities.
- Consumer Electronics: Used in devices like high-definition televisions and gaming consoles to enhance processing capabilities and support advanced user interfaces.
- Industrial Automation: Applied in control systems for manufacturing processes, improving automation reliability and precision.
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