XCV1000E-7FG900I
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- Mfr.Part #
- XCV1000E-7FG900I
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 660 I/O 900FBGA
- Stock
- 39,754
- In Stock ：
- 39,754
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Peak Reflow Temperature (Cel) :
- 225
- ECCN Code :
- 3A991.D
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Form :
- Ball
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Series :
- Virtex®-E
- Packaging :
- Tray
- Pbfree Code :
- No
- Number of Outputs :
- 660
- Mount :
- Surface Mount
- Radiation Hardening :
- No
- Terminal Position :
- BOTTOM
- JESD-609 Code :
- e0
- Number of Gates :
- 1569178
- Terminal Pitch :
- 1mm
- Clock Frequency :
- 400MHz
- Package / Case :
- 900-BBGA
- Number of Terminations :
- 900
- Published :
- 1999
- RoHS Status :
- Non-RoHS Compliant
- Number of Pins :
- 900
- Number of LABs/CLBs :
- 6144
- Lead Free :
- Contains Lead
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Logic Elements/Cells :
- 27648
- Operating Supply Voltage :
- 1.8V
- RAM Size :
- 48kB
- Base Part Number :
- XCV1000E
- Pin Count :
- 900
- Supply Voltage :
- 1.8V
- HTS Code :
- 8542.39.00.01
- Combinatorial Delay of a CLB-Max :
- 0.42 ns
- Voltage - Supply :
- 1.71V~1.89V
- Operating Temperature :
- -40°C~100°C TJ
- Length :
- 31mm
- Mounting Type :
- Surface Mount
- Speed Grade :
- 7
- Total RAM Bits :
- 393216
- Number of I/O :
- 660
- Width :
- 31mm
- Height Seated (Max) :
- 2.6mm
- Datasheets
- XCV1000E-7FG900I
FPGAs AMD Xilinx XCV1000E-7FG900I Overview
The FPGAs AMD Xilinx XCV1000E-7FG900I is a highly versatile field-programmable gate array designed to meet the intensive demands of modern digital circuits. Manufactured by the renowned AMD Xilinx, this FPGA features a robust 900FBGA package that provides substantial I/O capabilities with 660 inputs/outputs, making it exceptionally suited for complex digital processing tasks. This device is optimized for applications requiring high-speed data processing and flexibility, ensuring scalability and adaptability in various high-tech installations. The strategic integration of this FPGA can significantly enhance system performance and efficiency, making it a cornerstone for developers looking to leverage advanced digital technologies.
XCV1000E-7FG900I Features
The XCV1000E-7FG900I FPGA is engineered with precision, featuring a 900-pin fine-pitch ball grid array (FBGA) that facilitates robust interfacing and compact mounting solutions. This device supports a wide range of logic operations and is ideal for environments where space and speed are at a premium. Its extensive I/O capability ensures flexible connectivity options, crucial for systems requiring complex and multiple data streams. Additionally, the device's high tolerance to environmental variations and operational reliability under extreme conditions make it a reliable choice for critical applications.
XCV1000E-7FG900I Applications
- Data Centers: Utilizes its high I/O capacity for managing vast amounts of data, optimizing data flow and storage solutions in server farms and storage area networks.
- Telecommunications: Employs its robust processing capabilities to handle complex signal processing tasks, enhancing network reliability and efficiency in communication infrastructure.
- Automotive Electronics: Supports advanced driver-assistance systems (ADAS) by processing multiple sensor inputs rapidly, improving vehicle safety and functionality.
- Medical Devices: Facilitates the development of medical imaging systems, such as MRI and ultrasound equipment, by accelerating data processing speeds and image resolution.
- Industrial Automation: Streamlines processes through its ability to control various sensors and actuators in real-time, boosting manufacturing precision and productivity.
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