XCV1000E-6FG900I
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- Mfr.Part #
- XCV1000E-6FG900I
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 660 I/O 900FBGA
- Stock
- 43,939
- In Stock ：
- 43,939
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Series :
- Virtex®-E
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel) :
- 225
- Clock Frequency :
- 357MHz
- Number of LABs/CLBs :
- 6144
- Terminal Pitch :
- 1mm
- ECCN Code :
- 3A991.D
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Length :
- 31mm
- Number of Gates :
- 1569178
- Published :
- 2004
- RAM Size :
- 48kB
- Mount :
- Surface Mount
- Lead Free :
- Contains Lead
- Base Part Number :
- XCV1000E
- Voltage - Supply :
- 1.71V~1.89V
- Terminal Position :
- BOTTOM
- JESD-609 Code :
- e0
- Packaging :
- Tray
- Speed Grade :
- 6
- Number of Logic Elements/Cells :
- 27648
- Package / Case :
- 900-BBGA
- Pin Count :
- 900
- HTS Code :
- 8542.39.00.01
- Combinatorial Delay of a CLB-Max :
- 0.47 ns
- Mounting Type :
- Surface Mount
- Number of Terminations :
- 900
- RoHS Status :
- Non-RoHS Compliant
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Terminal Form :
- Ball
- Operating Temperature :
- -40°C~100°C TJ
- Pbfree Code :
- No
- Total RAM Bits :
- 393216
- Number of Pins :
- 900
- Supply Voltage :
- 1.8V
- Radiation Hardening :
- No
- Number of I/O :
- 660
- Operating Supply Voltage :
- 1.8V
- Number of Outputs :
- 660
- Width :
- 31mm
- Datasheets
- XCV1000E-6FG900I
FPGAs AMD Xilinx XCV1000E-6FG900I Overview
The FPGAs AMD Xilinx XCV1000E-6FG900I is a highly advanced field-programmable gate array (FPGA) designed for robust digital processing and versatility across numerous applications. This FPGA is built to deliver exceptional performance with its high I/O pin count and a dense 900FBGA packaging, making it an ideal solution for complex digital systems. Manufactured by AMD Xilinx, a leader in digital design innovation, the XCV1000E-6FG900I caters to high-demand systems requiring rapid prototyping and scalable integration capabilities. Its enhanced configuration settings, coupled with power efficiency and high-speed transceiver links, make it perfectly suited for developing sophisticated hardware in the telecommunications, automotive, and defense sectors.
XCV1000E-6FG900I Features
This FPGA model boasts a range of features including 660 I/Os which provide extensive connectivity options, making it adaptable for various complex digital interfaces. The 900FBGA package ensures a compact form factor while maintaining high functionality and thermal stability under load. Enhanced security features are also integrated, securing applications against potential vulnerabilities.
XCV1000E-6FG900I Applications
- Data Centers: Utilized for managing vast amounts of data processing, providing rapid throughput and improved data integrity.
- Telecommunications Equipment: Enhances signal processing capabilities for base stations and network routers, offering higher bandwidth and improved data flow management.
- Automotive Applications: Used in advanced driver-assistance systems (ADAS) to process real-time sensory data and perform complex computations needed for autonomous driving technologies.
- Aerospace and Defense: Implements critical navigation and control systems, ensuring high reliability and compliance with stringent military specifications for performance and security.
- Industrial Automation: Drives automation in manufacturing processes through sophisticated control systems, improving operational efficiency and machine-to-machine communication.
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