XCV100-6BG256C

Manufacturer :

AMD Xilinx

Product Category :

FPGAs (Field Programmable Gate Array)

Number of LABs/CLBs :

600

HTS Code :

8542.39.00.01

Package / Case :

256-BBGA

Published :

2000

Number of Outputs :

180

Operating Temperature :

0°C~85°C TJ

Number of I/O :

180

Qualification Status :

Not Qualified

Mounting Type :

Surface Mount

Clock Frequency :

333MHz

Combinatorial Delay of a CLB-Max :

0.6 ns

Series :

Virtex®

ECCN Code :

EAR99

Number of CLBs :

600

Terminal Form :

Ball

JESD-609 Code :

e0

Terminal Finish :

Tin/Lead (Sn63Pb37)

Terminal Pitch :

1.27mm

RoHS Status :

Non-RoHS Compliant

Reach Compliance Code :

not_compliant

Total RAM Bits :

40960

Mount :

Surface Mount

RAM Size :

5kB

Pbfree Code :

No

Terminal Position :

BOTTOM

Power Supplies :

1.5/3.32.5V

Height Seated (Max) :

2.55mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Pin Count :

256

Voltage - Supply :

2.375V~2.625V

Width :

27mm

Time@Peak Reflow Temperature-Max (s) :

30

Programmable Logic Type :

FIELD PROGRAMMABLE GATE ARRAY

Number of Terminations :

256

Number of Pins :

256

Packaging :

Tray

Lead Free :

Contains Lead

Number of Logic Elements/Cells :

2700

Length :

27mm

Base Part Number :

XCV100

Supply Voltage :

2.5V

Number of Gates :

108904

Peak Reflow Temperature (Cel) :

225