XCS30-3BG256C
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- Mfr.Part #
- XCS30-3BG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-BBGA
- Datasheet
- Download
- Description
- IC FPGA 192 I/O 256BGA
- Stock
- 8,834
- In Stock ：
- 8,834
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Pitch :
- 1.27mm
- RAM Size :
- 2.3kB
- Length :
- 27mm
- Speed Grade :
- 3
- Series :
- Spartan®
- Mounting Type :
- Surface Mount
- Width :
- 27mm
- Pin Count :
- 256
- Operating Temperature :
- 0°C~85°C TJ
- Terminal Form :
- Ball
- Combinatorial Delay of a CLB-Max :
- 1.6 ns
- Terminal Position :
- BOTTOM
- Power Supplies :
- 5V
- Number of Registers :
- 1536
- Lead Free :
- Contains Lead
- RoHS Status :
- Non-RoHS Compliant
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Height Seated (Max) :
- 2.55mm
- Voltage - Supply :
- 4.75V~5.25V
- Packaging :
- Tray
- Number of I/O :
- 192
- Number of Pins :
- 256
- Clock Frequency :
- 125MHz
- Number of Equivalent Gates :
- 10000
- Number of CLBs :
- 576
- Number of Logic Cells :
- 576
- Base Part Number :
- XCS30
- Number of Outputs :
- 196
- Number of LABs/CLBs :
- 576
- Operating Supply Voltage :
- 5V
- Total RAM Bits :
- 18432
- Number of Terminations :
- 256
- Mount :
- Surface Mount
- Package / Case :
- 256-BBGA
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Supply Voltage :
- 5V
- Number of Logic Elements/Cells :
- 1368
- Radiation Hardening :
- No
- JESD-609 Code :
- e0
- Published :
- 1999
- Number of Gates :
- 30000
- Datasheets
- XCS30-3BG256C
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FPGAs AMD Xilinx XCS30-3BG256C Overview
The AMD Xilinx XCS30-3BG256C FPGA represents a significant advancement in programmable technology, bringing superior integration and performance to your engineering solutions. This device is designed to address the rigorous demands of modern digital signal processing and control applications, offering a robust suite of features encapsulated in a compact 256-BGA package. With 192 programmable I/O pins, this FPGA is incredibly versatile, making it ideal for a wide range of applications that require high-speed data processing and flexibility. The inclusion of the XCS30-3BG256C in your hardware setup ensures scalability and adaptability, enhancing your product's ability to meet future technological advancements.
XCS30-3BG256C Features
- High I/O pin count (192 pins) for extensive interfacing capabilities.
- Compact 256-BGA package for reduced board space and enhanced system integration.
- Adaptable logic cells that allow for highly customized configurations and designs.
- Efficient power management features that ensure reduced power consumption while maintaining high performance.
XCS30-3BG256C Applications
- Telecommunications Equipment: Utilizes its high I/O count and programmability to manage signal processing tasks and data flow control, enhancing network reliability and efficiency.
- Automotive Electronics: Employs its robust processing capabilities to handle complex algorithms necessary for advanced driver-assistance systems (ADAS) and in-vehicle infotainment systems.
- Consumer Electronics: Ideal for integration into smart home devices and portable electronics, where its compact size and power efficiency are crucial.
- Industrial Automation: Critical in the control systems and robotic applications, offering the flexibility and reliability required in harsh industrial environments.
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