XCF32PFSG48C

Manufacturer :

AMD Xilinx

Product Category :

Configuration Proms for FPGAs

Peak Reflow Temperature (Cel) :

260

Package / Case :

48-TFBGA, CSPBGA

Terminal Finish :

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

Terminal Position :

BOTTOM

Memory Type :

FLASH, PROM

Operating Temperature :

-40°C~85°C

Termination :

SMD/SMT

Terminal Form :

Ball

REACH SVHC :

Unknown

Number of Pins :

48

RoHS Status :

ROHS3 Compliant

Height :

860μm

Pin Count :

48

Packaging :

Tray

Number of Functions :

1

JESD-609 Code :

e2

Factory Lead Time :

10 Weeks

Width :

8mm

Length :

9mm

Supply Current-Max :

0.04mA

Additional Feature :

IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL

Power Supplies :

1.5/3.31.8V

Lead Free :

Lead Free

Operating Mode :

SYNCHRONOUS

HTS Code :

8542.32.00.51

Programmable Type :

In System Programmable

Endurance :

20000 Write/Erase Cycles

Pbfree Code :

yes

Memory Density :

33554432 bit

Interface :

Parallel, Serial

Base Part Number :

XCF*P

Data Retention Time-Min :

20

Number of Terminations :

48

Memory Size :

32MB

Qualification Status :

Not Qualified

ECCN Code :

EAR99

Supply Voltage-Max (Vsup) :

2V

Voltage - Supply :

1.65V~2V

Mount :

Surface Mount

Organization :

32MX1

Mounting Type :

Surface Mount

Supply Voltage-Min (Vsup) :

1.65V

Published :

1999

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Supply Voltage :

1.8V

Time@Peak Reflow Temperature-Max (s) :

30