XC7Z045-3FFG900E
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- Mfr.Part #
- XC7Z045-3FFG900E
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 1GHZ 900FCBGA
- Stock
- 11,667
- In Stock ：
- 11,667
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- JESD-609 Code :
- e1
- Package / Case :
- 900-BBGA, FCBGA
- RoHS Status :
- ROHS3 Compliant
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Memory Type :
- ROMless
- Operating Temperature :
- 0°C~100°C TJ
- RAM (words) :
- 256000
- Core Architecture :
- ARM
- Base Part Number :
- XC7Z045
- Data Bus Width :
- 32b
- Supply Voltage-Max (Vsup) :
- 1.05V
- Peak Reflow Temperature (Cel) :
- 245
- Terminal Pitch :
- 1mm
- Number of I/O :
- 130
- Published :
- 2009
- Series :
- Zynq®-7000
- JESD-30 Code :
- S-PBGA-B900
- Frequency :
- 1GHz
- Primary Attributes :
- Kintex™-7 FPGA, 350K Logic Cells
- Terminal Position :
- BOTTOM
- Boundary Scan :
- yes
- Peripherals :
- DMA
- Architecture :
- MCU, FPGA
- Operating Supply Voltage :
- 1V
- Packaging :
- Tray
- HTS Code :
- 8542.39.00.01
- Length :
- 31mm
- Contact Plating :
- Copper, Silver, Tin
- RAM Size :
- 256KB
- Factory Lead Time :
- 10 Weeks
- Number of Terminations :
- 900
- Speed Grade :
- -3
- Supply Voltage :
- 1V
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Radiation Hardening :
- No
- Terminal Form :
- Ball
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Surface Mount :
- yes
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Height Seated (Max) :
- 3.35mm
- ECCN Code :
- 3A991.D
- Datasheets
- XC7Z045-3FFG900E
900 Terminations 0°C~100°C TJ XC7Z045 System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC has been developed.There is a 900-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq®-7000 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Kintex™-7 FPGA, 350K Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 130 inputs and outputs.Ideally, a power supply with a voltage of 1V should be used.An excessive voltage of 1.05V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.system on a chip benefits from 900 terminations.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z045.During operation, the wireless SoC runs at a frequency of 1GHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-3FFG900E System On Chip (SoC) applications.
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
- Remote control
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