XC7Z045-3FFG676E
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- Mfr.Part #
- XC7Z045-3FFG676E
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 1GHZ 676FCBGA
- Stock
- 49,239
- In Stock ：
- 49,239
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Operating Temperature :
- 0°C~100°C TJ
- JESD-609 Code :
- e1
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Terminal Position :
- BOTTOM
- HTS Code :
- 8542.39.00.01
- Terminal Pitch :
- 1mm
- Radiation Hardening :
- No
- ECCN Code :
- 3A991.D
- Surface Mount :
- yes
- Primary Attributes :
- Kintex™-7 FPGA, 350K Logic Cells
- Length :
- 27mm
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Peak Reflow Temperature (Cel) :
- 245
- RoHS Status :
- ROHS3 Compliant
- Terminal Form :
- Ball
- Number of I/O :
- 130
- Architecture :
- MCU, FPGA
- Base Part Number :
- XC7Z045
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Boundary Scan :
- yes
- Supply Voltage-Max (Vsup) :
- 1.05V
- Data Bus Width :
- 32b
- JESD-30 Code :
- S-PBGA-B676
- Number of Terminations :
- 676
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Speed Grade :
- -3
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Height Seated (Max) :
- 3.37mm
- Peripherals :
- DMA
- RAM Size :
- 256KB
- Packaging :
- Tray
- Frequency :
- 1GHz
- Memory Type :
- ROMless
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Factory Lead Time :
- 10 Weeks
- Published :
- 2009
- Operating Supply Voltage :
- 1V
- RAM (words) :
- 256000
- Series :
- Zynq®-7000
- Package / Case :
- 676-BBGA, FCBGA
- Core Architecture :
- ARM
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Contact Plating :
- Copper, Silver, Tin
- Supply Voltage :
- 1V
- Datasheets
- XC7Z045-3FFG676E
676 Terminations 0°C~100°C TJ XC7Z045 System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
There are Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processors in this SoC.This system on a chip is packaged as 676-BBGA, FCBGA by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The Zynq®-7000 series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.There is one thing to note about this SoC security: it combines Kintex™-7 FPGA, 350K Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 130 I/Os.A power supply with a 1V rating is recommended.There is no safe voltage for the SoCs wireless above 1.05V.It is really beneficial to have system on a chip since there are 676 terminations in total.By searching XC7Z045, you can find system on chips with similar specs and purposes.There is 1GHz frequency associated with the wireless SoC.It uses ARM as its core architecture.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-3FFG676E System On Chip (SoC) applications.
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
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