XC7Z045-2FFG900I
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- Mfr.Part #
- XC7Z045-2FFG900I
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 800MHZ 900FCBGA
- Stock
- 8,975
- In Stock ：
- 8,975
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Package / Case :
- 900-BBGA, FCBGA
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Number of Terminations :
- 900
- JESD-609 Code :
- e1
- Base Part Number :
- XC7Z045
- Peripherals :
- DMA
- Number of I/O :
- 130
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Supply Voltage :
- 1V
- Published :
- 2009
- HTS Code :
- 8542.39.00.01
- Operating Temperature :
- -40°C~100°C TJ
- Supply Voltage-Max (Vsup) :
- 1.05V
- Peak Reflow Temperature (Cel) :
- 245
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- ECCN Code :
- 3A991.D
- JESD-30 Code :
- S-PBGA-B900
- Primary Attributes :
- Kintex™-7 FPGA, 350K Logic Cells
- Core Architecture :
- ARM
- Speed Grade :
- -2
- Operating Supply Voltage :
- 1V
- Radiation Hardening :
- No
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Boundary Scan :
- yes
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Architecture :
- MCU, FPGA
- Frequency :
- 800MHz
- RAM (words) :
- 256000
- RoHS Status :
- ROHS3 Compliant
- Height Seated (Max) :
- 3.35mm
- Data Bus Width :
- 32b
- RAM Size :
- 256KB
- Packaging :
- Tray
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Surface Mount :
- yes
- Series :
- Zynq®-7000
- Memory Type :
- ROMless
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Contact Plating :
- Copper, Silver, Tin
- Terminal Form :
- Ball
- Terminal Position :
- BOTTOM
- Length :
- 31mm
- Terminal Pitch :
- 1mm
- Factory Lead Time :
- 10 Weeks
- Datasheets
- XC7Z045-2FFG900I
900 Terminations -40°C~100°C TJ XC7Z045 System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
On this SoC, there is Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor.Assigned with the package 900-BBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq®-7000 series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines Kintex™-7 FPGA, 350K Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 130 I/Os.It is recommended to use a 1V power supply.In the SoCs wireless, voltages above 1.05V are considered unsafe.In total, there are 900 terminations, which is great for system on a chip.XC7Z045 will give you system on chips with similar specifications and purposes.It operates at a frequency of 800MHz.In terms of core architecture, the SoC meaning relies on ARM.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-2FFG900I System On Chip (SoC) applications.
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
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