XC7Z045-2FFG676I
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- Mfr.Part #
- XC7Z045-2FFG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 800MHZ 676FCBGA
- Stock
- 495
- In Stock ：
- 495
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Supply Voltage-Max (Vsup) :
- 1.05V
- Terminal Pitch :
- 1mm
- Height Seated (Max) :
- 3.37mm
- JESD-609 Code :
- e1
- Surface Mount :
- yes
- Published :
- 2009
- Speed Grade :
- -2
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Data Bus Width :
- 32b
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Peak Reflow Temperature (Cel) :
- 245
- Operating Supply Voltage :
- 1V
- Supply Voltage :
- 1V
- Peripherals :
- DMA
- Series :
- Zynq®-7000
- HTS Code :
- 8542.39.00.01
- Terminal Form :
- Ball
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes :
- Kintex™-7 FPGA, 350K Logic Cells
- JESD-30 Code :
- S-PBGA-B676
- Radiation Hardening :
- No
- RAM (words) :
- 256000
- Package / Case :
- 676-BBGA, FCBGA
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- RAM Size :
- 256KB
- Factory Lead Time :
- 10 Weeks
- Base Part Number :
- XC7Z045
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Number of Terminations :
- 676
- Architecture :
- MCU, FPGA
- Number of I/O :
- 130
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Operating Temperature :
- -40°C~100°C TJ
- Packaging :
- Tray
- ECCN Code :
- 3A991.D
- RoHS Status :
- ROHS3 Compliant
- Boundary Scan :
- yes
- Memory Type :
- ROMless
- Frequency :
- 800MHz
- Core Architecture :
- ARM
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Terminal Position :
- BOTTOM
- Contact Plating :
- Copper, Silver, Tin
- Length :
- 27mm
- Datasheets
- XC7Z045-2FFG676I
676 Terminations -40°C~100°C TJ XC7Z045 System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A core processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is used to build this SoC.Its package is 676-BBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq®-7000 series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.A key point to note is that this SoC security combines Kintex™-7 FPGA, 350K Logic Cells.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 130.A 1V power supply should be used.There are voltages higher than 1.05V that should be avoided when using the SoCs wireless.Having 676 terminations in total makes system on a chip possible.Searching XC7Z045 will yield system on chips with similar specs and purposes.800MHz is the wireless SoC's frequency.Based on the core architecture of ARM, the SoC meaning has a high level of performance.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-2FFG676I System On Chip (SoC) applications.
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
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