XC7Z045-1FFG900C
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- Mfr.Part #
- XC7Z045-1FFG900C
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 667MHZ 900FCBGA
- Stock
- 990
- In Stock ：
- 990
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Radiation Hardening :
- No
- Peak Reflow Temperature (Cel) :
- 245
- ECCN Code :
- 3A991.D
- Height Seated (Max) :
- 3.35mm
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Core Architecture :
- ARM
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Speed Grade :
- -1
- HTS Code :
- 8542.39.00.01
- Supply Voltage :
- 1V
- Primary Attributes :
- Kintex™-7 FPGA, 350K Logic Cells
- Number of Logic Elements/Cells :
- 190000
- Packaging :
- Tray
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- RAM Size :
- 256KB
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Peripherals :
- DMA
- Terminal Position :
- BOTTOM
- Terminal Pitch :
- 1mm
- Surface Mount :
- yes
- Package / Case :
- 900-BBGA, FCBGA
- Published :
- 2009
- JESD-609 Code :
- e1
- Max Supply Voltage :
- 3.3V
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Memory Type :
- ROMless
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Frequency :
- 667MHz
- Contact Plating :
- Copper, Silver, Tin
- Number of Terminations :
- 900
- Operating Temperature :
- 0°C~85°C TJ
- Length :
- 31mm
- Number of I/O :
- 130
- Boundary Scan :
- yes
- RAM (words) :
- 256000
- Architecture :
- MCU, FPGA
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Number of Pins :
- 900
- Factory Lead Time :
- 10 Weeks
- Data Bus Width :
- 32b
- Series :
- Zynq®-7000
- Min Supply Voltage :
- 1.2V
- Terminal Form :
- Ball
- RoHS Status :
- ROHS3 Compliant
- Base Part Number :
- XC7Z045
- Datasheets
- XC7Z045-1FFG900C
900 Terminations 0°C~85°C TJ 900 Pin XC7Z045 System On Chip Zynq®-7000 Series 130 I/O 1V Min 1.2V V Max 3.3V V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq®-7000 series.The average operating temps for this SoC meaning should be 0°C~85°C TJ.One important thing to mark down is that this SoC meaning combines Kintex™-7 FPGA, 350K Logic Cells.Housed in the state-of-art Tray package.130 I/Os in total are included in this SoC part.It is advised to utilize a 1V power supply.There are 900 terminations in total and that really benefits system on a chip.You can get system on chips with similar specs and purposes by searching XC7Z045.The wireless SoC works at a frequency of 667MHz.The SoC meaning is based on the core architecture of ARM.This is the 900-pin version of the computer SoC.It is rated with 3.3V maximum supply voltage.It is supplied with at least 1.2V power.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-1FFG900C System On Chip (SoC) applications.
- Automotive gateway
- Body control module
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
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