XC7Z045-1FFG676C
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- Mfr.Part #
- XC7Z045-1FFG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 667MHZ 676FCBGA
- Stock
- 3
- In Stock ：
- 3
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Length :
- 27mm
- Peripherals :
- DMA
- Series :
- Zynq®-7000
- Frequency :
- 667MHz
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Radiation Hardening :
- No
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Architecture :
- MCU, FPGA
- RAM Size :
- 256KB
- Factory Lead Time :
- 10 Weeks
- Packaging :
- Tray
- Primary Attributes :
- Kintex™-7 FPGA, 350K Logic Cells
- Number of I/O :
- 130
- Operating Supply Voltage :
- 1V
- Contact Plating :
- Copper, Silver, Tin
- Supply Voltage-Max (Vsup) :
- 1.05V
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- JESD-609 Code :
- e1
- Surface Mount :
- yes
- Terminal Pitch :
- 1mm
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Operating Temperature :
- 0°C~85°C TJ
- Package / Case :
- 676-BBGA, FCBGA
- Memory Type :
- ROMless
- Supply Voltage :
- 1V
- Speed Grade :
- -1
- Published :
- 2009
- Data Bus Width :
- 32b
- JESD-30 Code :
- S-PBGA-B676
- ECCN Code :
- 3A991.D
- RAM (words) :
- 256000
- Base Part Number :
- XC7Z045
- Peak Reflow Temperature (Cel) :
- 245
- Number of Terminations :
- 676
- Boundary Scan :
- yes
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Terminal Position :
- BOTTOM
- Terminal Form :
- Ball
- Core Architecture :
- ARM
- HTS Code :
- 8542.39.00.01
- Height Seated (Max) :
- 3.37mm
- RoHS Status :
- ROHS3 Compliant
- Datasheets
- XC7Z045-1FFG676C
676 Terminations 0°C~85°C TJ XC7Z045 System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 676-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq®-7000 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.This SoC security combines Kintex™-7 FPGA, 350K Logic Cells, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.130 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1V.The SoCs wireless cannot operate at a voltage greater than 1.05V because it is considered unsafe for the application.In total, there are 676 terminations, so system on a chip is really aided by this.A search for XC7Z045 will result in system on chips that have similar specs and purposes.A frequency of 667MHz is used by the wireless SoC to operate.In order to operate the SoC meaning, it must be based on the core architecture of ARM.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-1FFG676C System On Chip (SoC) applications.
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
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