XC7Z030-3FFG676E
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- Mfr.Part #
- XC7Z030-3FFG676E
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 1GHZ 676FCBGA
- Stock
- 13,006
- In Stock ：
- 13,006
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Terminal Pitch :
- 1mm
- Terminal Position :
- BOTTOM
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Terminal Form :
- Ball
- HTS Code :
- 8542.39.00.01
- Frequency :
- 1GHz
- Series :
- Zynq®-7000
- Speed Grade :
- -3
- Supply Voltage :
- 1V
- RoHS Status :
- ROHS3 Compliant
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes :
- Kintex™-7 FPGA, 125K Logic Cells
- Operating Supply Voltage :
- 1V
- Radiation Hardening :
- No
- Contact Plating :
- Copper, Silver, Tin
- JESD-609 Code :
- e1
- Packaging :
- Tray
- Supply Voltage-Max (Vsup) :
- 1.05V
- RAM Size :
- 256KB
- Package / Case :
- 676-BBGA, FCBGA
- Surface Mount :
- yes
- Boundary Scan :
- yes
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- RAM (words) :
- 256000
- Number of Pins :
- 676
- Peak Reflow Temperature (Cel) :
- 245
- Data Bus Width :
- 32b
- Base Part Number :
- XC7Z030
- ECCN Code :
- 3A991.D
- Number of Terminations :
- 676
- Operating Temperature :
- 0°C~100°C TJ
- Core Architecture :
- ARM
- Published :
- 2009
- Architecture :
- MCU, FPGA
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Length :
- 27mm
- Number of I/O :
- 130
- Factory Lead Time :
- 10 Weeks
- Height Seated (Max) :
- 3.24mm
- Peripherals :
- DMA
- Datasheets
- XC7Z030-3FFG676E
676 Terminations 0°C~100°C TJ 676 Pin XC7Z030 System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC has been developed.The manufacturer assigns this system on a chip with a 676-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq®-7000 series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Kintex™-7 FPGA, 125K Logic Cells together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.For safe operation, it is advisable to utilize a power supply with 1V voltage.In the SoCs wireless, high voltages above 1.05V are considered dangerous and should not be used.The system on a chip uses 676 terminations in total.By searching XC7Z030, you will find system on chips with similar specs and purposes.A wireless SoC that operates at a frequency of 1GHz is what the wireless SoC does.This SoC meaning utilizes a core architecture of ARM as its foundation.In this computer SoC, there are 676 pins.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-3FFG676E System On Chip (SoC) applications.
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
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