XC7Z030-1FBG484C
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- Mfr.Part #
- XC7Z030-1FBG484C
- Manufacturer
- AMD Xilinx
- Package / Case
- 484-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 667MHZ 484FCBGA
- Stock
- 35,762
- In Stock ：
- 35,762
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Architecture :
- MCU, FPGA
- Length :
- 23mm
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Number of Terminations :
- 484
- Radiation Hardening :
- No
- Frequency :
- 667MHz
- RAM (words) :
- 256000
- Terminal Position :
- BOTTOM
- RAM Size :
- 256KB
- Packaging :
- Tray
- Peripherals :
- DMA
- Supply Voltage-Max (Vsup) :
- 1.05V
- Height Seated (Max) :
- 2.54mm
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Supply Voltage :
- 1V
- Published :
- 2009
- Peak Reflow Temperature (Cel) :
- 250
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Package / Case :
- 484-BBGA, FCBGA
- Number of I/O :
- 130
- Data Bus Width :
- 32b
- Primary Attributes :
- Kintex™-7 FPGA, 125K Logic Cells
- Speed Grade :
- -1
- Operating Temperature :
- 0°C~85°C TJ
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Series :
- Zynq®-7000
- HTS Code :
- 8542.39.00.01
- Terminal Form :
- Ball
- Operating Supply Voltage :
- 1V
- Core Architecture :
- ARM
- Surface Mount :
- yes
- RoHS Status :
- ROHS3 Compliant
- Contact Plating :
- Copper, Silver, Tin
- Time@Peak Reflow Temperature-Max (s) :
- 30
- ECCN Code :
- EAR99
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Boundary Scan :
- yes
- Base Part Number :
- XC7Z030
- Factory Lead Time :
- 10 Weeks
- JESD-609 Code :
- e1
- Terminal Pitch :
- 1mm
- Number of Pins :
- 484
- Datasheets
- XC7Z030-1FBG484C
484 Terminations 0°C~85°C TJ 484 Pin XC7Z030 System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s) are used in the construction of this SoC.Manufacturer assigns package 484-BBGA, FCBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq®-7000 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be 0°C~85°C TJ.Taking note of the fact that this SoC security combines Kintex™-7 FPGA, 125K Logic Cells is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 130 I/Os.Use a power supply with a voltage of 1V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.05V.A system on a chip benefits from having 484 terminations.Searching XC7Z030 will bring up system on chips with similar specs and purposes.At 667MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.The computer SoC is the 484-pin version.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-1FBG484C System On Chip (SoC) applications.
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
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