XC7VX330T-2FFV1761C
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- Mfr.Part #
- XC7VX330T-2FFV1761C
- Manufacturer
- AMD Xilinx
- Package / Case
- 1760-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 700 I/O 1760FCBGA
- Stock
- 31,435
- In Stock ：
- 31,435
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Supply Voltage :
- 1V
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Factory Lead Time :
- 10 Weeks
- Height Seated (Max) :
- 3.77mm
- JESD-30 Code :
- S-PBGA-B1761
- Terminal Position :
- BOTTOM
- Number of I/O :
- 700
- Number of Logic Elements/Cells :
- 326400
- Published :
- 2010
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Length :
- 42.5mm
- Mounting Type :
- Surface Mount
- Terminal Form :
- Ball
- Number of LABs/CLBs :
- 25500
- Surface Mount :
- yes
- ECCN Code :
- 3A991.D
- Package / Case :
- 1760-BBGA, FCBGA
- Number of Terminations :
- 1761
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- JESD-609 Code :
- e1
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Pitch :
- 1mm
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Packaging :
- Bulk
- Series :
- Virtex®-7 XT
- RoHS Status :
- ROHS3 Compliant
- HTS Code :
- 8542.39.00.01
- Voltage - Supply :
- 0.97V~1.03V
- Total RAM Bits :
- 27648000
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Width :
- 42.5mm
- Operating Temperature :
- 0°C~85°C TJ
- Datasheets
- XC7VX330T-2FFV1761C
FPGAs AMD Xilinx XC7VX330T-2FFV1761C Overview
The FPGAs AMD Xilinx XC7VX330T-2FFV1761C represents a powerful and versatile solution in the field of programmable logic devices. Designed by AMD Xilinx, this integrated circuit excels in complex digital computations and system-level integration. Encased in a 1760FCBGA package, it features 700 I/O options, offering extensive connectivity and compatibility for a broad range of applications. Its robust architecture is particularly well-suited for developers looking to push the boundaries of hardware acceleration, signal processing, and high-speed communications. The use of the FPGAs AMD Xilinx XC7VX330T-2FFV1761C enhances the efficiency and performance of sophisticated electronic systems, making it an ideal choice for high-volume B2B scenarios.
XC7VX330T-2FFV1761C Features
This FPGA from AMD Xilinx boasts a high I/O count and a dense, flexible programmable logic layout, enabling advanced customization and scalability. Key features include high-speed DSP slices, advanced memory interfacing, and energy-efficient design, providing a platform for developing high-performance, multi-functional devices with reduced power consumption and improved data throughput.
XC7VX330T-2FFV1761C Applications
- Telecommunications Infrastructure: Used in routers, switches, and base stations, this FPGA facilitates rapid data processing and enhanced signal integrity critical for modern telecom networks.
- Data Center Solutions: Implements acceleration technologies for servers and storage systems, improving data throughput and energy efficiency in cloud services and large data repositories.
- Aerospace and Defense Systems: Provides robust, secure programmable solutions for navigation systems, radar, and communication equipment, meeting stringent reliability and performance standards.
- Medical Imaging Equipment: Enables complex signal processing algorithms necessary for real-time imaging applications, such as MRI and ultrasound, ensuring high resolution and fast processing speeds.
- Automotive Electronics: Supports advanced driver-assistance systems (ADAS) and infotainment systems, offering the processing power and reliability required in critical automotive applications.
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