XC7S75-2FGGA676C

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Mfr.Part #
XC7S75-2FGGA676C
Manufacturer
AMD Xilinx
Package / Case
676-BGA
Datasheet
Download
Description
IC FPGA 400 I/O 676FPBGA
Stock
4,555
In Stock :
4,555

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Package / Case :
676-BGA
Factory Lead Time :
10 Weeks
Packaging :
Tray
JESD-30 Code :
S-PBGA-B676
Supply Voltage :
1V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
HTS Code :
8542.39.00.01
Number of Terminations :
676
Terminal Form :
Ball
Number of I/O :
400
Mounting Type :
Surface Mount
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
RoHS Status :
ROHS3 Compliant
Series :
Spartan®-7
Number of LABs/CLBs :
6000
Surface Mount :
yes
Total RAM Bits :
4331520
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Terminal Position :
BOTTOM
Operating Temperature :
0°C~85°C TJ
Voltage - Supply :
0.95V~1.05V
Combinatorial Delay of a CLB-Max :
1.05 ns
Number of Logic Elements/Cells :
76800
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Datasheets
XC7S75-2FGGA676C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC7S75-2FGGA676C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:676-BGA, Number of Terminations:676, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, XC7S75-2FGGA676C pinout, XC7S75-2FGGA676C datasheet PDF, XC7S75-2FGGA676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC7S75-2FGGA676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC7S75-2FGGA676C


FPGAs AMD Xilinx XC7S75-2FGGA676C Overview

The FPGAs AMD Xilinx XC7S75-2FGGA676C is a highly versatile and powerful field programmable gate array (FPGA) designed for applications requiring high-speed, reliable digital processing and flexible hardware customization. Manufactured by AMD Xilinx, this FPGA features a dense 676-pin flip-chip BGA (ball grid array) packaging, which makes it suitable for compact and complex digital environments. With a strong focus on performance and adaptability, the XC7S75-2FGGA676C provides a robust solution for designers looking to push the boundaries of technology in various demanding sectors.

XC7S75-2FGGA676C Features

The XC7S75-2FGGA676C FPGA stands out with its impressive array of features, including a vast array of 400 I/O pins that facilitate extensive connectivity and interfacing capabilities. This high I/O count is crucial for applications needing numerous parallel inputs and outputs such as advanced computing systems and large-scale digital signal processing. The FPGA’s ability to support reconfiguration with its programmable logic cells allows for highly customized solutions tailored to specific project requirements.

XC7S75-2FGGA676C Applications

  • Telecommunications Equipment: Utilized in routers and switches, the XC7S75-2FGGA676C helps manage data flow efficiently, ensuring high-speed data transmission and enhanced signal integrity.
  • Data Centers: Critical in managing the immense data processing needs, this FPGA aids in server load balancing and high-speed data storage solutions, maintaining system performance even under heavy loads.
  • Aerospace and Defense: Applied in satellite communications and avionics, the FPGA provides the necessary processing power and reliability required in harsh environments and mission-critical applications.
  • Automotive Industry: Supports advanced driver-assistance systems (ADAS) by processing multiple real-time inputs from vehicle sensors, aiding in safer driving and better vehicle control.
  • Consumer Electronics: Powers high-definition video processing units in devices such as digital cameras and smart TVs, ensuring smooth video playback and high-quality image processing.
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