XC7K70T-L2FBG676E

Share

Or copy the link below:

Mfr.Part #
XC7K70T-L2FBG676E
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 300 I/O 676FCBGA
Stock
990
In Stock :
990

Request A Quote(RFQ)

* Fullname:
* Company:
* E-Mail:
  Phone:
  Comment:
* Quantity:
Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Number of Registers :
82000
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Supply Voltage :
0.9V
HTS Code :
8542.39.00.01
Terminal Form :
Ball
Number of Terminations :
676
Package / Case :
676-BBGA, FCBGA
Packaging :
Tray
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Number of Logic Elements/Cells :
65600
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Total RAM Bits :
4976640
JESD-609 Code :
e1
Length :
27mm
Published :
2010
Mounting Type :
Surface Mount
Number of LABs/CLBs :
5125
Width :
27mm
Power Supplies :
0.91.83.3V
Combinatorial Delay of a CLB-Max :
0.91 ns
Mount :
Surface Mount
Factory Lead Time :
10 Weeks
Terminal Position :
BOTTOM
RAM Size :
607.5kB
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
ECCN Code :
3A991.D
Operating Supply Voltage :
1V
Operating Temperature :
0°C~100°C TJ
Height Seated (Max) :
2.54mm
Terminal Pitch :
1mm
Number of I/O :
300
RoHS Status :
ROHS3 Compliant
Number of Pins :
676
Base Part Number :
XC7K70T
Series :
Kintex®-7
Qualification Status :
Not Qualified
Number of Outputs :
300
Pin Count :
676
Pbfree Code :
yes
Voltage - Supply :
0.97V~1.03V
Datasheets
XC7K70T-L2FBG676E
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC7K70T-L2FBG676E from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:676, Package / Case:676-BBGA, FCBGA, Mounting Type:Surface Mount, Operating Temperature:0°C~100°C TJ, Number of Pins:676, Base Part Number:XC7K70T, XC7K70T-L2FBG676E pinout, XC7K70T-L2FBG676E datasheet PDF, XC7K70T-L2FBG676E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC7K70T-L2FBG676E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC7K70T-L2FBG676E


FPGAs AMD Xilinx XC7K70T-L2FBG676E Overview

The AMD Xilinx XC7K70T-L2FBG676E FPGA stands out as a high-performance, adaptable solution engineered to meet the intensive demands of modern digital applications. This device from AMD Xilinx's Kintex-7 family combines exceptional processing power with high-level functionality, making it ideal for system designers looking to optimize both cost and performance. Its 676-pin FCBGA (ball grid array) packaging ensures robust physical connectivity, while the 300 I/O options provide ample flexibility for interfacing with other components in complex systems. Integrating this FPGA into your designs ensures scalability and adaptability, crucial for industries requiring rapid prototyping and high-speed data processing.

XC7K70T-L2FBG676E Features

This FPGA is designed to support a wide array of functionalities. Key features include a high logic gate density, comprehensive I/O connectivity, and advanced memory interfaces which are optimized for efficiency and speed. The XC7K70T-L2FBG676E also supports multiple clock management features and DSP slices, increasing the device's ability to handle complex, multifaceted operations and algorithms efficiently. Additionally, its compatibility with advanced serial connectivity standards, such as PCI Express and Gigabit Ethernet, further enhances its utility in high-performance environments.

XC7K70T-L2FBG676E Applications

  • Data Centers: Utilized in server infrastructure to facilitate high-speed data processing and storage solutions, enhancing data throughput and system reliability.
  • Telecommunications: Deployed in communication infrastructure equipment to enable robust signal processing capabilities, essential for 5G technology and network enhancements.
  • Aerospace and Defense: Integral in avionics and military communication devices, offering reliable performance in extreme conditions and supporting advanced security protocols.
  • Medical Imaging: Applied in diagnostic equipment such as MRI and CT scanners, where its processing power helps in rendering high-resolution images quickly and efficiently.
  • Industrial Automation: Used in control systems to improve operational efficiency, provide real-time processing capabilities, and enhance machine-to-machine communication.
Purchase

You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.

RFQ (Request for Quotations)

It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.

Payment Method

For your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.

IMPORTANT NOTICE

You may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.

Shipping Method

Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...

Shipping Cost

Shipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.

The basic freight (for package ≤0.5 KG ) depends on the time zones and countries

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.

RFQ
BOM