XC7K410T-2FFV900C
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- Mfr.Part #
- XC7K410T-2FFV900C
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 500 I/O 900FCBGA
- Stock
- 22,530
- In Stock ：
- 22,530
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Published :
- 2009
- Packaging :
- Bulk
- Width :
- 31mm
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of Terminations :
- 900
- Package / Case :
- 900-BBGA, FCBGA
- Operating Temperature :
- 0°C~85°C TJ
- Number of LABs/CLBs :
- 31775
- Mounting Type :
- Surface Mount
- Factory Lead Time :
- 12 Weeks
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Supply Voltage :
- 1V
- Total RAM Bits :
- 29306880
- JESD-30 Code :
- S-PBGA-B900
- Series :
- Kintex®-7
- ECCN Code :
- 3A991.D
- Number of I/O :
- 500
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Height Seated (Max) :
- 3.35mm
- Number of Logic Elements/Cells :
- 406720
- RoHS Status :
- ROHS3 Compliant
- Voltage - Supply :
- 0.97V~1.03V
- Terminal Form :
- Ball
- JESD-609 Code :
- e1
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Terminal Position :
- BOTTOM
- Length :
- 31mm
- HTS Code :
- 8542.39.00.01
- Surface Mount :
- yes
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Terminal Pitch :
- 1mm
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Datasheets
- XC7K410T-2FFV900C
FPGAs AMD Xilinx XC7K410T-2FFV900C Overview
The AMD Xilinx XC7K410T-2FFV900C is a high-performance Field Programmable Gate Array (FPGA) that provides a robust platform for the development of advanced electronics systems. Ideal for applications requiring high-speed data processing and flexible hardware configuration, this device features 500 I/O pins housed in a 900FCBGA package, offering exceptional integration capabilities. The XC7K410T-2FFV900C is designed to meet the rigorous demands of today’s cutting-edge digital applications, providing both scalability and power efficiency, making it an excellent choice for developers looking to push the boundaries of technological innovation.
XC7K410T-2FFV900C Features
This FPGA is equipped with 500 input/output pins, enabling extensive connectivity for a wide range of applications. The 900-ball flip-chip BGA (FCBGA) packaging ensures a compact form factor while allowing for efficient heat dissipation and reliability under various operational conditions. The XC7K410T-2FFV900C also supports a multitude of configurable logic blocks for customized programming and adaptation to complex digital computations.
XC7K410T-2FFV900C Applications
- Telecommunications: Utilized in infrastructure for data processing and signal management, enhancing communication speeds and reliability.
- Automotive: Integral in advanced driver-assistance systems (ADAS) for processing inputs from vehicular sensors and executing real-time responses.
- Data Centers: Employs in high-performance servers and network devices for managing large volumes of data with improved data transfer rates and security.
- Consumer Electronics: Applied in smart home devices and high-definition multimedia interfaces, providing the necessary processing power for device interoperability and enhanced user experiences.
- Aerospace and Defense: Used in navigation systems and complex avionics for robust, reliable performance in critical missions and environments.
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