XC7A200T-3FB676E
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- Mfr.Part #
- XC7A200T-3FB676E
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 400 I/O 676FCBGA
- Stock
- 20,731
- In Stock ：
- 20,731
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Radiation Hardening :
- No
- Number of I/O :
- 400
- Supplier Device Package :
- 676-FCBGA (27x27)
- Package / Case :
- 676-BBGA, FCBGA
- Min Operating Temperature :
- 0°C
- Series :
- Artix-7
- Number of Logic Blocks (LABs) :
- 16825
- Number of Logic Elements/Cells :
- 215360
- Number of LABs/CLBs :
- 16825
- Speed Grade :
- 3
- Mounting Type :
- Surface Mount
- RAM Size :
- 1.6MB
- Base Part Number :
- XC7A200T
- Published :
- 2009
- RoHS Status :
- Non-RoHS Compliant
- Max Operating Temperature :
- 100°C
- Voltage - Supply :
- 0.95V~1.05V
- Operating Temperature :
- 0°C~100°C
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Packaging :
- Tray
- Propagation Delay :
- 110 ps
- Mount :
- Surface Mount
- Operating Supply Voltage :
- 1V
- Number of Registers :
- 269200
- Total RAM Bits :
- 13455360
- Factory Lead Time :
- 11 Weeks
- Datasheets
- XC7A200T-3FB676E
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FPGAs AMD Xilinx XC7A200T-3FB676E Overview
The FPGAs AMD Xilinx XC7A200T-3FB676E is a high-performance field-programmable gate array designed for advanced applications that require substantial logic, DSP performance, and high I/O bandwidth. This robust component is engineered to cater to the demands of high-speed connectivity and real-time processing, featuring a dense arrangement of 400 I/Os packed into a 676-pin flip-chip ball grid array (FCBGA) package. This FPGA is ideal for developers looking to push the boundaries of technology in data processing, telecommunications, and advanced digital computing, ensuring flexibility and scalability for various complex designs and applications.
XC7A200T-3FB676E Features
The XC7A200T-3FB676E FPGA from AMD Xilinx stands out with its substantial logic capacity, making it suitable for highly complex algorithms and processes. The device boasts advanced features that include high-performance DSP slices for efficient data manipulation and processing power, a flexible I/O interface that supports various communication standards, and integrated blocks for PCIe, enhancing its capability for high-speed data transfer. Its thermal management capabilities ensure reliable performance even under strenuous conditions.
XC7A200T-3FB676E Applications
- Telecommunications Infrastructure: Utilized in base stations and network routers for signal processing and data flow management, enhancing network efficiency and reliability.
- Video Processing: Ideal for high-definition video editing equipment, where it manages complex video processing tasks to deliver clear and crisp images.
- Automotive: Employs in driver assistance systems to process multiple inputs from sensors, providing real-time responses crucial for safety.
- Industrial: Applied in control systems for manufacturing lines, improving automation accuracy and equipment coordination.
- Data Centers: Supports high-speed data processing and storage solutions, optimizing data throughput and energy efficiency in server farms.
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