XC6VSX315T-2FF1759I

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Mfr.Part #
XC6VSX315T-2FF1759I
Manufacturer
AMD Xilinx
Package / Case
1760-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 720 I/O 1759FCBGA
Stock
20,792
In Stock :
20,792

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Mount :
Surface Mount
Pbfree Code :
No
Published :
2008
Factory Lead Time :
10 Weeks
Operating Temperature :
-40°C~100°C TJ
JESD-609 Code :
e0
RoHS Status :
Non-RoHS Compliant
Contact Plating :
Lead, Tin
Base Part Number :
XC6VSX315T
Packaging :
Tray
Terminal Position :
BOTTOM
Number of Outputs :
720
Series :
Virtex®-6 SXT
Height Seated (Max) :
3.5mm
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
RAM Size :
3.1MB
Mounting Type :
Surface Mount
Terminal Form :
Ball
Terminal Finish :
Tin/Lead (Sn63Pb37)
Number of Pins :
1759
Number of LABs/CLBs :
24600
Qualification Status :
Not Qualified
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Number of Logic Elements/Cells :
314880
ECCN Code :
3A001.A.7.A
Number of I/O :
720
Total RAM Bits :
25952256
Package / Case :
1760-BBGA, FCBGA
Supply Voltage :
1V
Terminal Pitch :
1mm
Voltage - Supply :
0.95V~1.05V
Reach Compliance Code :
not_compliant
Speed Grade :
2
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC6VSX315T-2FF1759I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Base Part Number:XC6VSX315T, Mounting Type:Surface Mount, Number of Pins:1759, Package / Case:1760-BBGA, FCBGA, XC6VSX315T-2FF1759I pinout, XC6VSX315T-2FF1759I datasheet PDF, XC6VSX315T-2FF1759I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC6VSX315T-2FF1759I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC6VSX315T-2FF1759I


FPGAs AMD Xilinx XC6VSX315T-2FF1759I Overview

The FPGAs AMD Xilinx XC6VSX315T-2FF1759I is a state-of-the-art integrated circuit designed for high-performance applications that demand reliable and versatile computational resources. Manufactured by AMD Xilinx, this FPGA features a robust 1759-pin FCBGA (Flip Chip Ball Grid Array) packaging, making it suitable for dense and compact hardware environments. With 720 configurable I/O ports, this device offers exceptional flexibility and connectivity, enabling it to meet diverse system requirements. The XC6VSX315T-2FF1759I is ideal for designers looking to harness superior performance for advanced digital processing tasks in sectors such as telecommunications, automotive, and data centers.

XC6VSX315T-2FF1759I Features

The XC6VSX315T-2FF1759I FPGA from AMD Xilinx is equipped with features that enhance its functionality and usability across various demanding applications. Key attributes include its high I/O pin count, scalable logic resources, and its support for advanced digital signal processing. High-speed transceivers enable rapid data transmission, while its high-level integration facilitates reduced power consumption and increased reliability. Furthermore, the device's compatibility with multiple programming languages and development environments ensures a versatile and user-friendly experience for system developers.

XC6VSX315T-2FF1759I Applications

  • Telecommunications Infrastructure: Utilized in routers, switches, and base stations to manage data flow efficiently and support high-speed network communications.
  • Automotive Applications: Deployed in advanced driver-assistance systems (ADAS) to process real-time sensor data and provide critical functionality such as collision avoidance and traffic navigation.
  • Data Processing Centers: Integral in data servers and storage solutions, ensuring rapid processing of vast amounts of data with high reliability and minimal latency.
  • Medical Equipment: Used in diagnostic and imaging tools, offering the necessary computational power to handle complex algorithms required for detailed visualizations and real-time analysis.
  • Aerospace and Defense: Crucial for avionics and military communication devices, where reliability and the ability to operate in harsh environments are paramount.
This structured response provides a comprehensive overview of the FPGA, emphasizing its suitability for B2B customers and highlighting specific applications where its advanced capabilities can be effectively utilized.
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