XC5VSX50T-3FFG665C
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- Mfr.Part #
- XC5VSX50T-3FFG665C
- Manufacturer
- AMD Xilinx
- Package / Case
- 665-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 360 I/O 665FCBGA
- Stock
- 10,643
- In Stock ：
- 10,643
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Height Seated (Max) :
- 2.9mm
- Mounting Type :
- Surface Mount
- Number of LABs/CLBs :
- 4080
- Pin Count :
- 665
- Qualification Status :
- Not Qualified
- Voltage - Supply :
- 0.95V~1.05V
- Terminal Finish :
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- RoHS Status :
- ROHS3 Compliant
- Terminal Form :
- Ball
- Clock Frequency :
- 1412MHz
- Supply Voltage :
- 1V
- RAM Size :
- 594kB
- Package / Case :
- 665-BBGA, FCBGA
- Width :
- 27mm
- Packaging :
- Tray
- Series :
- Virtex®-5 SXT
- Mount :
- Surface Mount
- Number of I/O :
- 360
- Reach Compliance Code :
- not_compliant
- Published :
- 1999
- Length :
- 27mm
- Operating Temperature :
- 0°C~85°C TJ
- Factory Lead Time :
- 10 Weeks
- Number of Pins :
- 665
- Number of Terminations :
- 665
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Speed Grade :
- 3
- Terminal Pitch :
- 1mm
- Power Supplies :
- 12.5V
- Number of Outputs :
- 360
- Peak Reflow Temperature (Cel) :
- 250
- Operating Supply Voltage :
- 1V
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Base Part Number :
- XC5VSX50T
- Number of Logic Elements/Cells :
- 52224
- JESD-609 Code :
- e1
- Total RAM Bits :
- 4866048
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Terminal Position :
- BOTTOM
- Datasheets
- XC5VSX50T-3FFG665C
FPGAs AMD Xilinx XC5VSX50T-3FFG665C Overview
The AMD Xilinx XC5VSX50T-3FFG665C is a highly capable FPGA (Field Programmable Gate Array) that excels in delivering efficient, flexible, and scalable solutions in complex digital circuits. Designed for high-performance applications that require rapid prototyping and a customizable logic tile architecture, this FPGA allows for a significant reduction in development times and increases the speed to market for numerous applications. The XC5VSX50T-3FFG665C model boasts an impressive integration of 360 I/O points packaged neatly in a 665FCBGA format, making it ideal for sophisticated digital processing tasks in both industrial and commercial settings.
XC5VSX50T-3FFG665C Features
This particular model features a robust configuration that is tailored to enhance performance and reliability:
- 360 input/output ports for extensive connectivity and interfacing capabilities.
- A compact 665-ball flip-chip BGA (FCBGA) package ensuring a minimal footprint on system boards.
- Advanced design and development tools supported by Xilinx, facilitating easier integration and quicker deployment.
XC5VSX50T-3FFG665C Applications
- Data Processing Systems: Utilized in high-speed computing tasks to manage large data sets efficiently and with high throughput.
- Telecommunications: Integral for development and deployment of telecommunications infrastructure, supporting complex digital signal processing.
- Automotive Systems: Employed in driver assistance systems (ADAS) to process multiple inputs from sensors and cameras for real-time decision making.
- Industrial Automation: Facilitates the control and automation of machinery and processes in manufacturing environments.
- Consumer Electronics: Key component in enhancing the performance of high-end consumer electronics, including multimedia devices and gaming consoles.
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