XC5VSX50T-2FF1136C
- Mfr.Part #
- XC5VSX50T-2FF1136C
- Manufacturer
- AMD Xilinx
- Package / Case
- 1136-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 480 I/O 1136FCBGA
- Stock
- 36,995
- In Stock :
- 36,995
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Mount :
- Surface Mount
- Number of Pins :
- 1136
- Mounting Type :
- Surface Mount
- Published :
- 1999
- Operating Supply Voltage :
- 1V
- Voltage - Supply :
- 0.95V~1.05V
- Packaging :
- Tray
- Number of Logic Elements/Cells :
- 52224
- Total RAM Bits :
- 4866048
- Number of I/O :
- 480
- Factory Lead Time :
- 16 Weeks
- RAM Size :
- 594kB
- Supplier Device Package :
- 1136-FCBGA (35x35)
- Min Operating Temperature :
- 0°C
- Max Operating Temperature :
- 85°C
- Operating Temperature :
- 0°C~85°C TJ
- Series :
- Virtex®-5 SXT
- Number of Logic Blocks (LABs) :
- 4080
- Number of LABs/CLBs :
- 4080
- Speed Grade :
- 2
- RoHS Status :
- Non-RoHS Compliant
- Package / Case :
- 1136-BBGA, FCBGA
- Base Part Number :
- XC5VSX50T
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Datasheets
- XC5VSX50T-2FF1136C

FPGAs AMD Xilinx XC5VSX50T-2FF1136C Overview
The AMD Xilinx XC5VSX50T-2FF1136C FPGA is a cutting-edge field programmable gate array that boasts exceptional versatility and performance. Designed to meet the complex demands of modern electronics, this component features an array of 480 I/O options packaged in a compact 1136FCBGA format. Ideal for high-speed and high-density applications, the XC5VSX50T-2FF1136C offers unparalleled flexibility in system design, enabling developers to innovate and iterate on designs with reduced time-to-market. The robust configuration of this FPGA makes it a perfect choice for applications requiring intensive processing and high data throughput, making it a cornerstone in the development of advanced electronic systems.
XC5VSX50T-2FF1136C Features
The XC5VSX50T-2FF1136C FPGA from AMD Xilinx is equipped with a variety of features designed to enhance functionality and performance. These include a large number of input/output options which facilitate comprehensive interfacing with a wide array of devices and systems. The high-density 1136 ball grid array (BGA) package ensures a minimal footprint while providing maximal functionality. Additionally, its advanced design supports high-speed digital signal processing which is crucial for complex computation tasks.
XC5VSX50T-2FF1136C Applications
- Telecommunications: Used in communication infrastructure to manage signal processing tasks efficiently, ensuring rapid data transmission and high signal integrity.
- Automotive Electronics: Integral in driver assistance systems where it processes multiple inputs from automotive sensors to provide real-time response and decision-making.
- Industrial Automation: Empowers control systems to perform complex calculations for machinery control, enhancing operational efficiency and safety.
- Medical Devices: Crucial in medical imaging systems, where it processes large volumes of data from imaging devices, enabling detailed and accurate diagnostics.
- Consumer Electronics: Used in devices like high-performance gaming consoles and home automation systems, providing the processing power needed for rich user experiences and complex scene rendering.
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