XC5VLX30-3FF676C

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Mfr.Part #
XC5VLX30-3FF676C
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 400 I/O 676FCBGA
Stock
2,367
In Stock :
2,367

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Length :
27mm
Base Part Number :
XC5VLX30
Number of Outputs :
400
Number of Terminations :
676
Packaging :
Tray
Number of Logic Elements/Cells :
30720
Voltage - Supply :
0.95V~1.05V
Mount :
Surface Mount
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Speed Grade :
3
Published :
1999
Peak Reflow Temperature (Cel) :
225
Operating Temperature :
0°C~85°C TJ
Pin Count :
676
Clock Frequency :
1412MHz
RoHS Status :
Non-RoHS Compliant
Width :
27mm
Number of Pins :
676
Operating Supply Voltage :
1V
Series :
Virtex®-5 LX
Mounting Type :
Surface Mount
Terminal Form :
Ball
JESD-609 Code :
e0
Number of LABs/CLBs :
2400
Total RAM Bits :
1179648
Terminal Position :
BOTTOM
Number of I/O :
400
Time@Peak Reflow Temperature-Max (s) :
30
Factory Lead Time :
10 Weeks
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Power Supplies :
12.5V
RAM Size :
144kB
Supply Voltage :
1V
Terminal Pitch :
1mm
Package / Case :
676-BBGA, FCBGA
Qualification Status :
Not Qualified
Datasheets
XC5VLX30-3FF676C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VLX30-3FF676C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC5VLX30, Number of Terminations:676, Operating Temperature:0°C~85°C TJ, Number of Pins:676, Mounting Type:Surface Mount, Package / Case:676-BBGA, FCBGA, XC5VLX30-3FF676C pinout, XC5VLX30-3FF676C datasheet PDF, XC5VLX30-3FF676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VLX30-3FF676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC5VLX30-3FF676C


FPGAs AMD Xilinx XC5VLX30-3FF676C Overview

The FPGAs AMD Xilinx XC5VLX30-3FF676C is an advanced field programmable gate array that offers versatile integration suited for a variety of demanding applications. This IC FPGA model from AMD Xilinx features a dense configuration of 400 I/Os packed into a 676-pin flip-chip ball grid array (FCBGA) package. It excels in environments where high-performance data processing and high-throughput are required. The combination of sophisticated technology and a high I/O count makes the XC5VLX30-3FF676C a prime choice for developers looking to push the boundaries of FPGA implementation in complex system designs.

XC5VLX30-3FF676C Features

The XC5VLX30-3FF676C FPGA boasts a comprehensive feature set that includes a high logic capacity, superior signal integrity, and enhanced programmability. This chip is ideal for projects that require high-speed interfacing and real-time data processing. Additionally, its compact 676FCBGA package ensures a reduced footprint while allowing robust connectivity options for complex circuit designs.

XC5VLX30-3FF676C Applications

  • Data Centers: Used in server applications that demand high-speed data processing and storage management capabilities.
  • Telecommunications: Integral in infrastructure for supporting high-bandwidth communication networks and signal processing.
  • Automotive: Utilized in advanced driver-assistance systems (ADAS) for processing multiple real-time inputs from sensors and cameras.
  • Industrial Automation: Employs high I/O capacity for managing complex operations in robotics and manufacturing processes.
  • Medical Imaging: Critical in handling the high data volumes produced by medical diagnostic equipment for real-time imaging and analysis.
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