XC5VLX30-3FF324C

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Mfr.Part #
XC5VLX30-3FF324C
Manufacturer
AMD Xilinx
Package / Case
324-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 220 I/O 324FCBGA
Stock
61
In Stock :
61

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of LABs/CLBs :
2400
Factory Lead Time :
10 Weeks
Terminal Form :
Ball
Height Seated (Max) :
2.85mm
Clock Frequency :
1412MHz
RAM Size :
144kB
Total RAM Bits :
1179648
Number of I/O :
220
Operating Supply Voltage :
1V
Time@Peak Reflow Temperature-Max (s) :
30
Number of Outputs :
220
Length :
19mm
RoHS Status :
Non-RoHS Compliant
Packaging :
Tray
Operating Temperature :
0°C~85°C TJ
Speed Grade :
3
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Terminations :
324
Number of Logic Elements/Cells :
30720
Terminal Position :
BOTTOM
Qualification Status :
Not Qualified
Voltage - Supply :
0.95V~1.05V
Base Part Number :
XC5VLX30
Power Supplies :
12.5V
Published :
1999
Peak Reflow Temperature (Cel) :
225
Package / Case :
324-BBGA, FCBGA
Width :
19mm
Number of Pins :
324
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Supply Voltage :
1V
Reach Compliance Code :
not_compliant
Series :
Virtex®-5 LX
Mount :
Surface Mount
Mounting Type :
Surface Mount
Pin Count :
324
JESD-609 Code :
e0
Terminal Pitch :
1mm
Datasheets
XC5VLX30-3FF324C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VLX30-3FF324C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Number of Terminations:324, Base Part Number:XC5VLX30, Package / Case:324-BBGA, FCBGA, Number of Pins:324, Mounting Type:Surface Mount, XC5VLX30-3FF324C pinout, XC5VLX30-3FF324C datasheet PDF, XC5VLX30-3FF324C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VLX30-3FF324C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC5VLX30-3FF324C


FPGAs AMD Xilinx XC5VLX30-3FF324C Overview

The AMD Xilinx XC5VLX30-3FF324C FPGA is a highly flexible and powerful integrated circuit designed for specialized computing tasks. This device is part of the broader family of Field Programmable Gate Arrays (FPGAs), which are renowned for their adaptability and efficiency in handling complex digital computations. The XC5VLX30-3FF324C offers an excellent balance between performance and cost, making it an ideal choice for developers looking to harness the power of FPGAs in their applications. With its robust 324-pin Flip-Chip Ball Grid Array (FCBGA) package and 220 I/O pins, this FPGA provides ample connectivity for a variety of design needs, ensuring compatibility and ease of integration into existing systems.

XC5VLX30-3FF324C Features

The AMD Xilinx XC5VLX30-3FF324C FPGA boasts a range of features that enhance its usability and performance in complex electronic designs. Key attributes include:

  • High I/O count: With 220 input/output pins, this FPGA offers extensive interfacing capabilities.
  • Compact 324FCBGA packaging: Ensures a reduced footprint while providing robust connectivity in a dense and efficient layout.
  • Advanced programmable logic: Allows for custom configuration to meet specific application demands, making it highly versatile across different industries.

XC5VLX30-3FF324C Applications

  • Telecommunications Equipment: Used in the development of routers and switches, the XC5VLX30-3FF324C can handle complex signal processing tasks, enhancing network efficiency and speed.
  • Automotive Systems: Integrates into automotive safety and control systems, providing the necessary processing power for advanced driver-assistance systems (ADAS).
  • Industrial Automation: Serves as a critical component in programmable logic controllers (PLCs), improving real-time control and operational efficiency in manufacturing processes.
  • Consumer Electronics: Supports high-performance requirements in devices like high-definition televisions and gaming consoles, where speed and reliability are paramount.
  • Medical Devices: Utilized in medical imaging systems, where its processing capabilities help in delivering sharper images and faster analysis for better diagnosis.
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