XC5VLX30-2FFG676C

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Mfr.Part #
XC5VLX30-2FFG676C
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 400 I/O 676FCBGA
Stock
34,181
In Stock :
34,181

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Qualification Status :
Not Qualified
Time@Peak Reflow Temperature-Max (s) :
30
Terminal Position :
BOTTOM
RAM Size :
144kB
Number of Pins :
676
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
RoHS Status :
ROHS3 Compliant
Mounting Type :
Surface Mount
Height Seated (Max) :
3mm
JESD-609 Code :
e1
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Published :
1999
Voltage - Supply :
0.95V~1.05V
Operating Temperature :
0°C~85°C TJ
Number of Logic Elements/Cells :
30720
Number of Terminations :
676
Pbfree Code :
yes
ECCN Code :
3A991.D
Package / Case :
676-BBGA, FCBGA
Number of LABs/CLBs :
2400
Number of Outputs :
400
Base Part Number :
XC5VLX30
Packaging :
Tray
Factory Lead Time :
10 Weeks
Peak Reflow Temperature (Cel) :
245
Terminal Pitch :
1mm
Reach Compliance Code :
not_compliant
Pin Count :
676
Number of I/O :
400
Total RAM Bits :
1179648
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Form :
Ball
Speed Grade :
2
Mount :
Surface Mount
Supply Voltage :
1V
Operating Supply Voltage :
1V
Series :
Virtex®-5 LX
Datasheets
XC5VLX30-2FFG676C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VLX30-2FFG676C from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:676, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Number of Terminations:676, Package / Case:676-BBGA, FCBGA, Base Part Number:XC5VLX30, XC5VLX30-2FFG676C pinout, XC5VLX30-2FFG676C datasheet PDF, XC5VLX30-2FFG676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VLX30-2FFG676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC5VLX30-2FFG676C


FPGAs AMD Xilinx XC5VLX30-2FFG676C Overview

The AMD Xilinx XC5VLX30-2FFG676C is a high-performance Field Programmable Gate Array (FPGA) designed to meet the demanding requirements of modern digital circuits. Engineered for versatility and efficiency, this FPGA integrates multiple functionalities within its 676-pin flip-chip ball grid array (FCBGA) package. It provides a robust platform for designers seeking to develop complex hardware systems in telecommunications, industrial applications, and consumer electronics. Equipped with 400 I/O pins, the XC5VLX30-2FFG676C offers extensive connectivity options, making it a cornerstone in the creation of multi-faceted and scalable electronic designs.

XC5VLX30-2FFG676C Features

This advanced FPGA model from AMD Xilinx boasts a range of features that enhance its performance and usability in sophisticated electronics design. These include a high I/O pin count for extensive external interfacing, a compact 676-pin package for space-sensitive applications, and support for numerous logic functions necessary for complex computation and signal processing tasks.

XC5VLX30-2FFG676C Applications

  • Telecommunications Equipment: Utilized in routers, switches, and base stations, the XC5VLX30-2FFG676C enhances signal processing capabilities and supports high-speed data transmission.
  • Automotive Systems: Suitable for use in advanced driver-assistance systems (ADAS), this FPGA contributes to the processing power required for real-time vehicle monitoring and control.
  • Consumer Electronics: Integrated into devices such as smart TVs and gaming consoles, it enables complex video processing and connectivity solutions, enhancing user experiences.
  • Industrial Automation: In PLCs and industrial controllers, the XC5VLX30-2FFG676C manages multiple input/output operations, improving efficiency and reliability in manufacturing processes.
This HTML code segment provides an engaging and informative overview of the XC5VLX30-2FFG676C FPGA, outlines its key features, and lists its applications across various high-tech fields.
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