XC4VLX15-11FF676C

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Mfr.Part #
XC4VLX15-11FF676C
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 320 I/O 676FCBGA
Stock
18,952
In Stock :
18,952

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Package / Case :
676-BBGA, FCBGA
ECCN Code :
3A991.D
Operating Supply Voltage :
1.2V
Mounting Type :
Surface Mount
Length :
27mm
Number of Terminations :
676
Height Seated (Max) :
3mm
Pin Count :
676
JESD-30 Code :
S-PBGA-B676
Time@Peak Reflow Temperature-Max (s) :
30
Number of I/O :
320
Operating Temperature :
0°C~85°C TJ
Supply Voltage :
1.2V
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Number of Inputs :
320
Voltage - Supply :
1.14V~1.26V
HTS Code :
8542.39.00.01
Width :
27mm
Number of Logic Elements/Cells :
13824
Terminal Pitch :
1mm
RAM Size :
108kB
Published :
1999
Series :
Virtex®-4 LX
Total RAM Bits :
884736
Terminal Finish :
Tin/Lead (Sn63Pb37)
Number of Outputs :
320
Terminal Form :
Ball
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of LABs/CLBs :
1536
Speed Grade :
11
JESD-609 Code :
e0
Clock Frequency :
1205MHz
Factory Lead Time :
15 Weeks
RoHS Status :
Non-RoHS Compliant
Qualification Status :
Not Qualified
Surface Mount :
yes
Terminal Position :
BOTTOM
Peak Reflow Temperature (Cel) :
225
Datasheets
XC4VLX15-11FF676C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC4VLX15-11FF676C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:676-BBGA, FCBGA, Mounting Type:Surface Mount, Number of Terminations:676, Operating Temperature:0°C~85°C TJ, XC4VLX15-11FF676C pinout, XC4VLX15-11FF676C datasheet PDF, XC4VLX15-11FF676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC4VLX15-11FF676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC4VLX15-11FF676C


FPGAs AMD Xilinx XC4VLX15-11FF676C Overview

The FPGAs AMD Xilinx XC4VLX15-11FF676C is a high-performance integrated circuit designed for versatility and optimal functionality in complex digital processing environments. Developed by industry leader AMD Xilinx, this FPGA features a dense layout encapsulated in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package, enabling robust interfacing and high-speed operation. Ideal for applications demanding significant logic and memory integration, the XC4VLX15-11FF676C is engineered to handle a multitude of simultaneous processes, making it a pivotal component for advanced technological solutions.

XC4VLX15-11FF676C Features

This FPGA is equipped with 320 input/output ports, providing expansive connectivity options and flexibility for system designers. It supports a wide range of logic configurations, making it adaptable to varied computational tasks and digital signal processing requirements. Its compact 676FCBGA package ensures that it fits into space-constrained environments while maintaining high performance and low power consumption.

XC4VLX15-11FF676C Applications

  • Data Centers: Utilized for managing data flow and processing operations, enhancing efficiency and reliability in high-demand scenarios.
  • Telecommunications: Critical in the deployment of infrastructure for both wired and wireless communication systems, ensuring rapid data transmission and processing capabilities.
  • Automotive: Integrated into driver assistance systems to process real-time data from sensors and cameras, improving vehicle safety and functionality.
  • Medical Imaging: Plays a key role in the processing of complex imaging algorithms, essential for devices such as MRI and CT scanners that require high-speed data handling.
  • Industrial Automation: Supports automation systems in factories and plants by managing multiple control systems simultaneously, ensuring precise and efficient operations.
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