XC3SD3400A-5FGG676C
- Mfr.Part #
- XC3SD3400A-5FGG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BGA
- Datasheet
- Download
- Description
- IC FPGA 469 I/O 676FBGA
- Stock
- 1,986
- In Stock :
- 1,986
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Factory Lead Time :
- 10 Weeks
- Base Part Number :
- XC3SD3400A
- Speed Grade :
- 5
- Number of Logic Blocks (LABs) :
- 5968
- RoHS Status :
- ROHS3 Compliant
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Operating Supply Voltage :
- 1.2V
- Mounting Type :
- Surface Mount
- Published :
- 2008
- Number of LABs/CLBs :
- 5968
- RAM Size :
- 283.5kB
- Max Operating Temperature :
- 85°C
- Min Operating Temperature :
- 0°C
- Operating Temperature :
- 0°C~85°C TJ
- Voltage - Supply :
- 1.14V~1.26V
- Total RAM Bits :
- 2322432
- Mount :
- Surface Mount
- Supplier Device Package :
- 676-FBGA (27x27)
- Series :
- Spartan®-3A DSP
- Number of Gates :
- 3400000
- Number of I/O :
- 469
- Packaging :
- Tray
- Number of Pins :
- 676
- Number of Logic Elements/Cells :
- 53712
- Package / Case :
- 676-BGA
- Datasheets
- XC3SD3400A-5FGG676C
FPGAs AMD Xilinx XC3SD3400A-5FGG676C Overview
The FPGAs AMD Xilinx XC3SD3400A-5FGG676C is a highly capable field programmable gate array (FPGA) designed to meet the demanding needs of modern electronic systems. Manufactured by AMD Xilinx, this integrated circuit boasts an advanced architecture that enables it to perform a wide range of digital processing tasks efficiently. The XC3SD3400A-5FGG676C comes in a 676-pin fine-pitch ball grid array (FBGA) package, which facilitates dense and compact board layouts, essential for today's miniaturized electronic assemblies. Its extensive I/O capabilities, with 469 programmable I/O lines, provide excellent versatility for interfacing with other components in complex systems, making it ideal for high-performance applications that require substantial data processing and high-speed communications.
XC3SD3400A-5FGG676C Features
This FPGA model offers robust features that enable designers to build more flexible, reliable, and high-performing designs. Key features include the large number of input/output ports, which allows for extensive customization and scalability in design applications. The device's programmability means it can be used across various applications, ensuring a broad utility spectrum. Moreover, its compatibility with standard design tools from AMD Xilinx helps reduce development time and cost, making it a preferred choice for both new projects and upgrades to existing systems.
XC3SD3400A-5FGG676C Applications
- Telecommunications: Utilized in communication infrastructure, the XC3SD3400A-5FGG676C manages data flow and signal processing tasks, enhancing bandwidth and reducing latency in networks.
- Automotive Systems: Supports advanced driver-assistance systems (ADAS) by processing multiple sensor inputs, providing real-time response capabilities essential for safety-critical applications.
- Consumer Electronics: Used in high-definition video devices, gaming consoles, and smart home devices to handle complex graphical and data processing tasks efficiently.
- Industrial Automation: Ideal for control systems in manufacturing processes, this FPGA can orchestrate multiple control units and sensors, ensuring high precision and operational efficiency.
- Medical Devices: In medical imaging equipment, the XC3SD3400A-5FGG676C processes vast amounts of imaging data quickly, aiding in faster and more accurate diagnostics.
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