XC3SD3400A-5FG676C
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- Mfr.Part #
- XC3SD3400A-5FG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 469 I/O 676FCBGA
- Stock
- 557
- In Stock ：
- 557
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Operating Temperature :
- 0°C~85°C TJ
- Operating Supply Voltage :
- 1.2V
- Supply Voltage :
- 1.2V
- Pin Count :
- 676
- Number of Gates :
- 3400000
- Number of I/O :
- 469
- Length :
- 27mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Terminal Form :
- Ball
- RAM Size :
- 283.5kB
- ECCN Code :
- 3A991.D
- Number of Logic Elements/Cells :
- 53712
- Total RAM Bits :
- 2322432
- Number of Pins :
- 676
- Speed Grade :
- 5
- Published :
- 2008
- JESD-609 Code :
- e0
- Package / Case :
- 676-BBGA, FCBGA
- Number of LABs/CLBs :
- 5968
- Number of Terminations :
- 676
- Clock Frequency :
- 280MHz
- Series :
- Spartan®-3A DSP
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Mounting Type :
- Surface Mount
- Terminal Pitch :
- 1mm
- Width :
- 27mm
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Height Seated (Max) :
- 2.6mm
- Mount :
- Surface Mount
- Number of Outputs :
- 409
- Base Part Number :
- XC3SD3400A
- Terminal Position :
- BOTTOM
- Factory Lead Time :
- 10 Weeks
- Voltage - Supply :
- 1.14V~1.26V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Packaging :
- Tray
- Peak Reflow Temperature (Cel) :
- 225
- Pbfree Code :
- No
- RoHS Status :
- Non-RoHS Compliant
- Qualification Status :
- Not Qualified
- Datasheets
- XC3SD3400A-5FG676C
FPGAs AMD Xilinx XC3SD3400A-5FG676C Overview
The FPGAs AMD Xilinx XC3SD3400A-5FG676C is a highly capable field-programmable gate array designed for applications that require high-speed, complex digital signal processing and high-density logic integration. This integrated circuit is manufactured by the renowned AMD Xilinx, ensuring top-notch performance and reliability. It comes in a 676-pin flip-chip ball grid array (FCBGA) package, facilitating efficient thermal management and compact design solutions. The device features 469 I/O ports, offering ample flexibility for interfacing with other components in sophisticated electronic systems. This FPGA is ideal for developers looking to implement advanced system-level designs within power-sensitive and space-constrained environments.
XC3SD3400A-5FG676C Features
The XC3SD3400A-5FG676C FPGA offers a robust suite of features that make it an essential component in any high-demand application. Key features include:
- High I/O pin count (469) for extensive interfacing capabilities.
- Advanced 676-pin FCBGA packaging for improved thermal and electrical performance.
- Flexible logic integration for customized digital signal processing tasks.
- Support for multiple design implementations due to its reprogrammable nature.
- Compatibility with AMD Xilinx's development tools for easier design and testing.
XC3SD3400A-5FG676C Applications
- Telecommunications Equipment: Utilized in the backbone infrastructure for signal processing tasks, facilitating faster data transmission and enhanced network reliability.
- Automotive Systems: Critical for driver assistance systems where fast data processing and high I/O counts are essential for integrating multiple sensors and actuators.
- Medical Imaging Devices: Employs its high-density logic to process complex algorithms required in advanced medical imaging technologies such as MRI and CT scanners.
- Industrial Automation: Plays a key role in controlling machinery and processes, improving efficiency and safety in factory settings through sophisticated control systems.
- Consumer Electronics: Integral in developing high-performance, feature-rich consumer electronics such as gaming consoles and smart TVs, providing support for detailed graphics and high-speed processing.
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