XC3SD3400A-4FG676I
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- Mfr.Part #
- XC3SD3400A-4FG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 469 I/O 676FCBGA
- Stock
- 18,910
- In Stock ：
- 18,910
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Width :
- 27mm
- RoHS Status :
- Non-RoHS Compliant
- Peak Reflow Temperature (Cel) :
- 225
- ECCN Code :
- 3A991.D
- Height Seated (Max) :
- 2.6mm
- Speed Grade :
- 4
- Mounting Type :
- Surface Mount
- Factory Lead Time :
- 10 Weeks
- Number of Logic Elements/Cells :
- 53712
- Packaging :
- Tray
- Total RAM Bits :
- 2322432
- Voltage - Supply :
- 1.14V~1.26V
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of Terminations :
- 676
- Qualification Status :
- Not Qualified
- Supply Voltage :
- 1.2V
- Operating Supply Voltage :
- 1.2V
- Number of Gates :
- 3400000
- Number of Outputs :
- 409
- JESD-609 Code :
- e0
- Clock Frequency :
- 250MHz
- Number of I/O :
- 469
- Terminal Pitch :
- 1mm
- Package / Case :
- 676-BBGA, FCBGA
- Base Part Number :
- XC3SD3400A
- Terminal Form :
- Ball
- Terminal Position :
- BOTTOM
- Pin Count :
- 676
- Published :
- 2008
- Number of LABs/CLBs :
- 5968
- Operating Temperature :
- -40°C~100°C TJ
- Mount :
- Surface Mount
- Pbfree Code :
- No
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Pins :
- 676
- Power Supplies :
- 1.22.5/3.3V
- RAM Size :
- 283.5kB
- Series :
- Spartan®-3A DSP
- Length :
- 27mm
- Datasheets
- XC3SD3400A-4FG676I
FPGAs AMD Xilinx XC3SD3400A-4FG676I Overview
The FPGAs AMD Xilinx XC3SD3400A-4FG676I is a high-performance, field-programmable gate array that excels in delivering enhanced programmability along with superior functionality and power efficiency. Designed by the renowned AMD Xilinx, this FPGA is housed in a 676-pin flip-chip ball grid array (FCBGA) package and supports a wide range of I/O options with 469 input/output ports, making it an ideal choice for complex digital circuits that require high-speed, multi-functional capabilities. The XC3SD3400A-4FG676I is crafted to meet the rigorous demands of modern digital applications, offering designers a flexible and scalable hardware platform to innovate and optimize their systems efficiently.
XC3SD3400A-4FG676I Features
This FPGA model boasts numerous features that cater to the needs of advanced digital designs. Key attributes include its extensive I/O capabilities, high-speed digital processing, and robust thermal performance under varying operational conditions. The XC3SD3400A-4FG676I also offers high integration potential, allowing for reduced system complexity and enhanced reliability in deployment. Its compatibility with various programming environments and tools from AMD Xilinx ensures that system developers can easily implement their designs with minimal hassle.
XC3SD3400A-4FG676I Applications
- Telecommunications: The XC3SD3400A-4FG676I can be integrated into networking equipment such as routers and switches to manage data flow efficiently and enhance connectivity performance.
- Automotive: Useful in driver assistance systems, this FPGA processes multiple sensor data streams in real-time, aiding in faster decision-making and system responsiveness.
- Industrial Automation: In automation and control systems, the XC3SD3400A-4FG676I helps in managing complex operations and machinery with precision and reliability.
- Consumer Electronics: Used in devices like high-definition televisions and gaming consoles, the FPGA improves processing power for better user experience and functionality.
- Medical Devices: This FPGA is pivotal in medical imaging systems, facilitating rapid and accurate image processing to assist in diagnostics and treatment planning.
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