XC3SD3400A-4FG676C
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- Mfr.Part #
- XC3SD3400A-4FG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 469 I/O 676FCBGA
- Stock
- 5,686
- In Stock ：
- 5,686
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Operating Temperature :
- 0°C~85°C TJ
- Base Part Number :
- XC3SD3400A
- Pin Count :
- 676
- Series :
- Spartan®-3A DSP
- Mounting Type :
- Surface Mount
- Total RAM Bits :
- 2322432
- Peak Reflow Temperature (Cel) :
- 225
- Package / Case :
- 676-BBGA, FCBGA
- Width :
- 27mm
- Pbfree Code :
- No
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Packaging :
- Tray
- Number of Outputs :
- 409
- Operating Supply Voltage :
- 1.2V
- RAM Size :
- 283.5kB
- Voltage - Supply :
- 1.14V~1.26V
- Terminal Position :
- BOTTOM
- Supply Voltage :
- 1.2V
- Number of Logic Elements/Cells :
- 53712
- Number of I/O :
- 469
- Speed Grade :
- 4
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Mount :
- Surface Mount
- Power Supplies :
- 1.22.5/3.3V
- Number of Terminations :
- 676
- Published :
- 2008
- Terminal Form :
- Ball
- JESD-609 Code :
- e0
- Terminal Pitch :
- 1mm
- Number of Pins :
- 676
- ECCN Code :
- 3A991.D
- Number of LABs/CLBs :
- 5968
- RoHS Status :
- Non-RoHS Compliant
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Length :
- 27mm
- Clock Frequency :
- 250MHz
- Height Seated (Max) :
- 2.6mm
- Reach Compliance Code :
- not_compliant
- Factory Lead Time :
- 10 Weeks
- Qualification Status :
- Not Qualified
- Number of Gates :
- 3400000
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Datasheets
- XC3SD3400A-4FG676C
FPGAs AMD Xilinx XC3SD3400A-4FG676C Overview
The FPGAs AMD Xilinx XC3SD3400A-4FG676C is a high-performance, field-programmable gate array designed for sophisticated digital processing and high-speed logic operations. As a critical component in advanced electronics, this FPGA from AMD Xilinx provides a robust platform for developing versatile and scalable hardware solutions. With its expansive array of 469 I/O pins housed in a 676FCBGA package, the XC3SD3400A-4FG676C is ideally suited for applications requiring dense, high-speed interfacing and flexible logic integration. This FPGA is tailored for designers looking to push the boundaries of technology in both commercial and industrial settings, offering a perfect blend of power, performance, and flexibility.
XC3SD3400A-4FG676C Features
This advanced FPGA features a highly configurable logic architecture which allows for rapid prototyping and modifications, a key advantage in fast-paced development environments. The XC3SD3400A-4FG676C supports a wide range of digital and mixed-signal applications, thanks to its 676-pin flip-chip ball grid array (FCBGA) that ensures high reliability and superior performance. Enhanced with a vast I/O capability, it accommodates extensive customization and scalability, making it a go-to choice for complex, multi-functional systems.
XC3SD3400A-4FG676C Applications
- Telecommunications Equipment: Utilized for its high-speed signal processing capabilities, the XC3SD3400A-4FG676C is essential in routers, switches, and base stations where performance and reliability are critical.
- Automotive Electronics: This FPGA is employed in advanced driver-assistance systems (ADAS) to process real-time inputs from multiple sensors, enhancing vehicle safety and performance.
- Industrial Automation: In industrial environments, the XC3SD3400A-4FG676C drives complex machinery control systems, facilitating improved automation and efficiency.
- Consumer Electronics: Ideal for high-definition multimedia interfaces and interactive devices, providing the necessary processing power and interfacing options for sophisticated consumer products.
- Medical Devices: Supports the development of medical imaging systems like ultrasound and MRI, offering the robust processing power required for detailed, real-time imaging.
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