XC3S700A-4FT256I
Or copy the link below:
- Mfr.Part #
- XC3S700A-4FT256I
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 161 I/O 256FTBGA
- Stock
- 2,783
- In Stock ：
- 2,783
Request A Quote(RFQ)
- * Fullname:
- * Company:
- * E-Mail:
- Phone:
- Comment:
- * Quantity:
- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Form :
- Ball
- Terminal Pitch :
- 1mm
- Height Seated (Max) :
- 1.55mm
- Mounting Type :
- Surface Mount
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Terminations :
- 256
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Package / Case :
- 256-LBGA
- Supply Voltage :
- 1.2V
- Series :
- Spartan®-3A
- Number of Outputs :
- 148
- Qualification Status :
- Not Qualified
- Width :
- 17mm
- Pin Count :
- 256
- Published :
- 1999
- Operating Supply Voltage :
- 1.2V
- Number of Logic Elements/Cells :
- 13248
- Voltage - Supply :
- 1.14V~1.26V
- RAM Size :
- 45kB
- Power Supplies :
- 1.21.2/3.33.3V
- Terminal Position :
- BOTTOM
- Total RAM Bits :
- 368640
- Number of I/O :
- 161
- Packaging :
- Tray
- Mount :
- Surface Mount
- RoHS Status :
- Non-RoHS Compliant
- Combinatorial Delay of a CLB-Max :
- 0.71 ns
- Length :
- 17mm
- Clock Frequency :
- 667MHz
- Operating Temperature :
- -40°C~100°C TJ
- Number of Pins :
- 256
- JESD-609 Code :
- e0
- Time@Peak Reflow Temperature-Max (s) :
- 30
- ECCN Code :
- EAR99
- Number of LABs/CLBs :
- 1472
- Base Part Number :
- XC3S700A
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Peak Reflow Temperature (Cel) :
- 240
- Number of Gates :
- 700000
- Factory Lead Time :
- 10 Weeks
- Speed Grade :
- 4
- Datasheets
- XC3S700A-4FT256I
FPGAs AMD Xilinx XC3S700A-4FT256I Overview
The FPGAs AMD Xilinx XC3S700A-4FT256I is a highly advanced field programmable gate array that offers substantial flexibility and performance for a variety of demanding applications. Manufactured by AMD Xilinx, this IC FPGA features 161 I/O pins packaged neatly in a 256FTBGA format, making it ideal for compact yet powerful electronic designs. The robust configuration and heat-resistant properties of this model, designated by the suffix 'I', indicate its suitability for industrial applications requiring high reliability under extreme conditions. With its impressive programmability, the XC3S700A-4FT256I facilitates rapid prototyping and reduces time-to-market, making it an invaluable component for developers looking to innovate and scale efficiently.
XC3S700A-4FT256I Features
The XC3S700A-4FT256I FPGA from AMD Xilinx boasts several key features that make it stand out in the market. It supports a wide range of logic functions with its substantial I/O capabilities. The device's 256-ball fine-pitch ball grid array (FBGA) package ensures a minimal footprint on the system board while allowing for dense and compact hardware layouts. Its industrial-grade specifications ensure robust performance in environments subjected to extreme temperatures and operating conditions. Moreover, the XC3S700A-4FT256I is compatible with Xilinx's advanced development software, facilitating easy integration and development across various platforms.
XC3S700A-4FT256I Applications
- Industrial Automation: In industrial control systems, the XC3S700A-4FT256I can manage multiple input/output operations, sensor data, and actuator controls, ensuring efficient process automation and real-time system monitoring.
- Telecommunications: Utilized in communication infrastructure, this FPGA supports complex signal processing tasks, such as base station development and network traffic management, enhancing data flow and signal integrity across networks.
- Automotive Technology: Critical for driver assistance systems, the XC3S700A-4FT256I processes inputs from multiple sensors rapidly, contributing to safer driving through features like collision avoidance systems and parking assistance.
- Consumer Electronics: In devices such as high-performance portable gadgets, this FPGA allows for significant customization of functionalities, supporting advanced user interfaces and multimedia processing.
- Medical Devices: It plays a crucial role in medical imaging equipment, handling vast data inputs and providing real-time processing capabilities necessary for complex imaging techniques like MRI and ultrasound.
You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.
RFQ (Request for Quotations)It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.
Payment MethodFor your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.
IMPORTANT NOTICEYou may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.
Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
Manufacturer related products
Catalog related products
Related products
- Follow Us
-
- Payment
-
- Subscribe
- Certification
-
-
