XC3S50A-4FTG256I
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- Mfr.Part #
- XC3S50A-4FTG256I
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 144 I/O 256FTBGA
- Stock
- 624
- In Stock ：
- 624
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Operating Supply Voltage :
- 1.2V
- Width :
- 17mm
- Mount :
- Surface Mount
- Terminal Form :
- Ball
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Pins :
- 256
- Packaging :
- Tray
- Terminal Pitch :
- 1mm
- Number of Outputs :
- 112
- Peak Reflow Temperature (Cel) :
- 260
- Qualification Status :
- Not Qualified
- Contact Plating :
- Copper, Silver, Tin
- Voltage - Supply :
- 1.14V~1.26V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of CLBs :
- 176
- RAM Size :
- 6.8kB
- JESD-609 Code :
- e1
- Factory Lead Time :
- 10 Weeks
- Series :
- Spartan®-3A
- Length :
- 17mm
- Pin Count :
- 256
- Power Supplies :
- 1.22.5/3.3V
- Speed Grade :
- 4
- Total RAM Bits :
- 55296
- REACH SVHC :
- No SVHC
- Terminal Position :
- BOTTOM
- ECCN Code :
- EAR99
- Number of I/O :
- 144
- Mounting Type :
- Surface Mount
- Number of Logic Elements/Cells :
- 1584
- Number of LABs/CLBs :
- 176
- Number of Gates :
- 50000
- Base Part Number :
- XC3S50A
- RoHS Status :
- ROHS3 Compliant
- Combinatorial Delay of a CLB-Max :
- 0.71 ns
- Pbfree Code :
- yes
- Clock Frequency :
- 667MHz
- Supply Voltage :
- 1.2V
- Height Seated (Max) :
- 1.55mm
- Number of Terminations :
- 256
- Package / Case :
- 256-LBGA
- Published :
- 2007
- Operating Temperature :
- -40°C~100°C TJ
- Datasheets
- XC3S50A-4FTG256I
FPGAs AMD Xilinx XC3S50A-4FTG256I Overview
The AMD Xilinx XC3S50A-4FTG256I FPGA is a highly capable field-programmable gate array designed for versatile applications across various industries. This FPGA offers a robust platform for developing complex digital computing systems and is engineered to provide a high level of integration and performance efficiency. Featuring 144 I/O pins housed in a compact 256FTBGA package, the XC3S50A-4FTG256I allows for extensive flexibility in system design and scalability. Its ability to be reprogrammed on the fly enhances its adaptability to evolving technological needs, making it an ideal choice for tech innovators and commercial electronics developers seeking a reliable, high-performance solution.
XC3S50A-4FTG256I Features
This particular model from AMD Xilinx stands out due to its dense I/O configuration, allowing it to interface with a wide array of peripheral devices and other ICs. The small footprint of the 256FTBGA package ensures that it can fit into space-constrained applications while still offering the robust capability of 144 I/Os. This FPGA is optimized for lower power consumption and increased data processing speeds, facilitating efficient operation and improved system reliability.
XC3S50A-4FTG256I Applications
- Consumer Electronics: Utilized in devices such as smartphones and tablets to manage signal processing and power management tasks, enhancing device functionality and user experience.
- Automotive Systems: Applied in automotive electronics for controlling and managing in-vehicle systems, improving safety and performance through advanced driver assistance systems (ADAS).
- Industrial Automation: Employs robust I/O capabilities in factory automation equipment to handle control and process optimization tasks, increasing efficiency and reducing operational costs.
- Medical Devices: Integrated into medical diagnostic equipment, where precision and reliability are critical for accurate data processing and patient monitoring.
- Telecommunications: Used in networking equipment to facilitate data transmission and encryption, ensuring high-speed communication and network reliability.
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