XC3S500E-4FTG256I
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- Mfr.Part #
- XC3S500E-4FTG256I
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 190 I/O 256FTBGA
- Stock
- 9,319
- In Stock ：
- 9,319
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Mounting Type :
- Surface Mount
- Number of Outputs :
- 149
- Packaging :
- Tray
- Power Supplies :
- 1.21.2/3.32.5V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Total RAM Bits :
- 368640
- Pbfree Code :
- yes
- Package / Case :
- 256-LBGA
- Qualification Status :
- Not Qualified
- Width :
- 17mm
- Published :
- 2001
- ECCN Code :
- EAR99
- Terminal Form :
- Ball
- Number of Terminations :
- 256
- Factory Lead Time :
- 10 Weeks
- Supply Voltage :
- 1.2V
- Terminal Position :
- BOTTOM
- Clock Frequency :
- 572MHz
- Height :
- 1mm
- JESD-609 Code :
- e1
- Operating Supply Voltage :
- 1.2V
- Series :
- Spartan®-3E
- Number of Logic Elements/Cells :
- 10476
- Base Part Number :
- XC3S500E
- Speed Grade :
- 4
- Voltage - Supply :
- 1.14V~1.26V
- Combinatorial Delay of a CLB-Max :
- 0.76 ns
- Pin Count :
- 256
- RoHS Status :
- ROHS3 Compliant
- Number of Registers :
- 9312
- Length :
- 17mm
- Number of LABs/CLBs :
- 1164
- Number of Pins :
- 256
- Mount :
- Surface Mount
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Gates :
- 500000
- Number of I/O :
- 190
- Peak Reflow Temperature (Cel) :
- 260
- RAM Size :
- 45kB
- Operating Temperature :
- -40°C~100°C TJ
- Datasheets
- XC3S500E-4FTG256I
FPGAs AMD Xilinx XC3S500E-4FTG256I Overview
The FPGAs AMD Xilinx XC3S500E-4FTG256I is a cutting-edge field-programmable gate array designed for the modern demands of high-speed digital signal processing and control applications. This highly versatile and reliable integrated circuit boasts a rich array of features including a robust 256FTBGA package that facilitates efficient heat dissipation and a wide array of I/O options. Tailored to meet the exacting requirements of industrial-grade applications, the XC3S500E-4FTG256I provides a flexible and economical solution for system designers looking to leverage the advanced capabilities of AMD Xilinx technologies. With its formidable logic capacity and the ability to be reprogrammed on-the-fly, this FPGA is an ideal choice for developers aiming to accelerate their time-to-market while maintaining the flexibility to adapt to evolving specifications and performance needs.
XC3S500E-4FTG256I Features
- IC FPGA with 190 I/O pins for versatile connectivity.
- 256FTBGA packaging for robust and reliable physical integration.
- Industrial temperature range support for high-reliability applications.
- Reconfigurable logic blocks for high adaptability and long-term utility.
XC3S500E-4FTG256I Applications
- Automotive Systems: Perfect for advanced driver-assistance systems (ADAS), where the FPGA can process complex algorithms for real-time decision-making.
- Telecommunications: Utilized in network routers and switches for high-speed data packet processing and signal integrity management.
- Consumer Electronics: Applied in multimedia devices to handle intensive video and audio processing tasks.
- Medical Devices: Integrated in medical imaging equipment for fast and accurate data analysis, enhancing diagnostic capabilities.
- Aerospace and Defense: Ideal for sophisticated signal processing in radar, communications, and avionics systems.
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