XC3S5000-4FGG900C

Share

Or copy the link below:

Mfr.Part #
XC3S5000-4FGG900C
Manufacturer
AMD Xilinx
Package / Case
900-BBGA
Datasheet
Download
Description
IC FPGA 633 I/O 900FBGA
Stock
44,050
In Stock :
44,050

Request A Quote(RFQ)

* Fullname:
* Company:
* E-Mail:
  Phone:
  Comment:
* Quantity:
Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
RAM Size :
234kB
Height Seated (Max) :
2.6mm
Operating Supply Voltage :
1.2V
Power Supplies :
1.21.2/3.32.5V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits :
1916928
Terminal Position :
BOTTOM
Base Part Number :
XC3S5000
Mounting Type :
Surface Mount
Supply Voltage :
1.2V
Pbfree Code :
yes
Width :
31mm
Published :
2009
Number of I/O :
633
Packaging :
Tray
Time@Peak Reflow Temperature-Max (s) :
30
Operating Temperature :
0°C~85°C TJ
Factory Lead Time :
10 Weeks
ECCN Code :
3A991.D
JESD-609 Code :
e1
Number of Logic Elements/Cells :
74880
Series :
Spartan®-3
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Pins :
900
Speed Grade :
4
Mount :
Surface Mount
Combinatorial Delay of a CLB-Max :
0.61 ns
RoHS Status :
ROHS3 Compliant
Length :
31mm
Number of Terminations :
900
Clock Frequency :
630MHz
Pin Count :
900
Terminal Pitch :
1mm
Qualification Status :
Not Qualified
Terminal Form :
Ball
Voltage - Supply :
1.14V~1.26V
Number of LABs/CLBs :
8320
Package / Case :
900-BBGA
Number of Gates :
5000000
Number of Outputs :
633
Peak Reflow Temperature (Cel) :
250
Datasheets
XC3S5000-4FGG900C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S5000-4FGG900C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC3S5000, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Number of Pins:900, Number of Terminations:900, Package / Case:900-BBGA, XC3S5000-4FGG900C pinout, XC3S5000-4FGG900C datasheet PDF, XC3S5000-4FGG900C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S5000-4FGG900C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S5000-4FGG900C


FPGAs AMD Xilinx XC3S5000-4FGG900C Overview

The FPGAs AMD Xilinx XC3S5000-4FGG900C represents a highly capable solution in the field of programmable logic devices, engineered by the renowned semiconductor manufacturer AMD Xilinx. This FPGA (Field Programmable Gate Array) is designed to cater to the demands of high-throughput, complex digital processing environments where flexibility and performance are paramount. Encapsulated in a 900FBGA (Fine Pitch Ball Grid Array) package, it integrates an impressive 633 I/O points, making it exceptionally versatile in a broad range of applications. The product's substantial logic and I/O capabilities make it an ideal choice for developers aiming to push the boundaries of digital and mixed-signal circuit design, ensuring both scalability and adaptability in demanding applications.

XC3S5000-4FGG900C Features

This advanced FPGA offers a multitude of features that enhance its usability and effectiveness in complex digital environments. Notably, the XC3S5000-4FGG900C boasts extensive input/output options, robust configuration settings, and the ability to support intricate digital signal processing (DSP) tasks. These features collectively empower engineers to develop sophisticated systems that require high-speed data processing and high levels of functionality and reliability.

XC3S5000-4FGG900C Applications

  • Telecommunications Infrastructure: Utilized in routers, switches, and base stations to manage data flow efficiently and ensure robust network reliability.
  • Automotive Systems: Plays a critical role in advanced driver-assistance systems (ADAS) by processing multiple inputs from sensors and cameras to enhance vehicle safety and navigation capabilities.
  • Industrial Automation: Integral in controlling machinery in automated production lines, improving operational efficiency and reducing human error.
  • Consumer Electronics: Key component in high-performance gaming consoles and home entertainment systems, providing enhanced graphics and real-time processing power.
  • Medical Devices: Used in imaging systems such as MRI and ultrasound equipment, facilitating complex image processing tasks and diagnostic capabilities.
Purchase

You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.

RFQ (Request for Quotations)

It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.

Payment Method

For your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.

IMPORTANT NOTICE

You may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.

Shipping Method

Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...

Shipping Cost

Shipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.

The basic freight (for package ≤0.5 KG ) depends on the time zones and countries

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.

RFQ
BOM