XC3S400A-5FGG320C
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- Mfr.Part #
- XC3S400A-5FGG320C
- Manufacturer
- AMD Xilinx
- Package / Case
- 320-BGA
- Datasheet
- Download
- Description
- IC FPGA 251 I/O 320FBGA
- Stock
- 33,085
- In Stock ：
- 33,085
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Base Part Number :
- XC3S400A
- Total RAM Bits :
- 368640
- ECCN Code :
- 3A991.D
- Peak Reflow Temperature (Cel) :
- 260
- Operating Supply Voltage :
- 1.2V
- Speed Grade :
- 5
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Series :
- Spartan®-3A
- Terminal Pitch :
- 1mm
- Combinatorial Delay of a CLB-Max :
- 0.62 ns
- Number of CLBs :
- 896
- Factory Lead Time :
- 10 Weeks
- Mounting Type :
- Surface Mount
- Number of Logic Elements/Cells :
- 8064
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Package / Case :
- 320-BGA
- Mount :
- Surface Mount
- Pbfree Code :
- yes
- Number of LABs/CLBs :
- 896
- Published :
- 1999
- Length :
- 19mm
- Clock Frequency :
- 770MHz
- Number of Gates :
- 400000
- Supply Voltage :
- 1.2V
- RoHS Status :
- ROHS3 Compliant
- RAM Size :
- 45kB
- Terminal Position :
- BOTTOM
- Number of Outputs :
- 192
- Number of Terminations :
- 320
- JESD-609 Code :
- e1
- Width :
- 19mm
- Qualification Status :
- Not Qualified
- Voltage - Supply :
- 1.14V~1.26V
- Number of Pins :
- 320
- Pin Count :
- 320
- Terminal Form :
- Ball
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Packaging :
- Tray
- Height Seated (Max) :
- 2mm
- Number of I/O :
- 251
- Operating Temperature :
- 0°C~85°C TJ
- Datasheets
- XC3S400A-5FGG320C
FPGAs AMD Xilinx XC3S400A-5FGG320C Overview
The AMD Xilinx XC3S400A-5FGG320C is a high-performance, field-programmable gate array (FPGA) designed for advanced integrated circuit applications. This robust FPGA offers a versatile solution for designers focusing on delivering high-speed and resource-efficient products in the electronics market. Utilizing advanced silicon technology, the XC3S400A-5FGG320C excels in delivering exceptional performance and flexibility, making it ideal for a wide range of applications, including telecommunications, automotive, and industrial systems. Its substantial I/O capabilities and compact 320-pin fine-pitch BGA (FBGA) package make it particularly suitable for space-constrained environments where performance cannot be compromised.
XC3S400A-5FGG320C Features
The XC3S400A-5FGG320C from AMD Xilinx features 251 I/O pins, providing ample connectivity for multiple peripherals and devices. The FPGA is built on a scalable architecture, allowing for efficient implementation of custom logic. It supports various logic optimization techniques, which enhance device performance while reducing power consumption. Additionally, its compatibility with multiple design environments ensures that it integrates smoothly into existing projects, significantly reducing development time and cost.
XC3S400A-5FGG320C Applications
- Telecommunications: Used in routers and switches for packet processing, the XC3S400A-5FGG320C enhances data transmission speeds and reliability in complex network infrastructures.
- Automotive Systems: Can be integrated into automotive safety systems, such as advanced driver-assistance systems (ADAS), to perform real-time data processing, improving vehicle safety and performance.
- Industrial Automation: Ideal for control systems in manufacturing plants, helping to automate processes and increase efficiency while maintaining high precision and reliability.
- Consumer Electronics: Applied in smart home devices, enabling sophisticated control and connectivity features that enhance user experiences.
- Medical Devices: Essential in medical imaging systems, where it processes complex algorithms rapidly to provide clear and accurate imaging results.
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