XC3S250E-5FTG256C
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- Mfr.Part #
- XC3S250E-5FTG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 172 I/O 256FTBGA
- Stock
- 1
- In Stock ：
- 1
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of CLBs :
- 612
- Series :
- Spartan®-3E
- Factory Lead Time :
- 10 Weeks
- Number of Pins :
- 256
- Number of Registers :
- 4896
- RAM Size :
- 27kB
- ECCN Code :
- EAR99
- Supply Voltage :
- 1.2V
- Combinatorial Delay of a CLB-Max :
- 0.66 ns
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Voltage - Supply :
- 1.14V~1.26V
- RoHS Status :
- ROHS3 Compliant
- Number of I/O :
- 172
- Published :
- 2009
- Base Part Number :
- XC3S250E
- Length :
- 17mm
- Number of Logic Elements/Cells :
- 5508
- Number of Outputs :
- 132
- Operating Supply Voltage :
- 1.2V
- Pin Count :
- 256
- Terminal Position :
- BOTTOM
- Pbfree Code :
- yes
- Speed Grade :
- 5
- Terminal Form :
- Ball
- Packaging :
- Tray
- Total RAM Bits :
- 221184
- JESD-609 Code :
- e1
- Qualification Status :
- Not Qualified
- Terminal Finish :
- TIN SILVER COPPER
- Terminal Pitch :
- 1mm
- Operating Temperature :
- 0°C~85°C TJ
- Number of Terminations :
- 256
- Number of Gates :
- 250000
- Width :
- 17mm
- Mounting Type :
- Surface Mount
- Package / Case :
- 256-LBGA
- Peak Reflow Temperature (Cel) :
- 260
- Mount :
- Surface Mount
- Number of LABs/CLBs :
- 612
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Datasheets
- XC3S250E-5FTG256C
FPGAs AMD Xilinx XC3S250E-5FTG256C Overview
The AMD Xilinx XC3S250E-5FTG256C, part of the renowned Spartan-3E FPGA series, offers a powerful combination of affordability and functionality tailored for cost-sensitive applications. This FPGA is built on a proven architecture that balances performance and power consumption effectively. The XC3S250E-5FTG256C is housed in a compact 256-pin FTBGA (Fine Pitch Ball Grid Array) package, supporting 172 I/Os, making it ideal for a wide range of embedded solutions. Its versatile nature allows it to cater to a variety of sectors, particularly enhancing its appeal in high-volume production environments where cost and space are critical considerations.
XC3S250E-5FTG256C Features
The XC3S250E-5FTG256C FPGA boasts a robust feature set that includes a large number of programmable logic cells, high-performance interfaces, and a flexible I/O system. It supports advanced digital processing capabilities, making it suitable for complex algorithms and multiprocessor configurations. Additionally, its low-power consumption and high functionality make it an excellent choice for designers looking to optimize system power and cost.
XC3S250E-5FTG256C Applications
- Consumer Electronics: Utilized in devices such as digital cameras and gaming consoles, where it enables sophisticated image processing and user interface enhancements.
- Automotive Systems: Applied in car infotainment and navigation systems, providing the necessary flexibility and processing power to handle complex user interfaces and connectivity options.
- Industrial Automation: Supports automation controllers and sensors, facilitating real-time processing and control tasks essential for modern industrial environments.
- Telecommunications: Critical in the development of network routers and switches, ensuring efficient data flow and management across multiple network layers.
- Medical Devices: Integrated into medical imaging systems, enhancing functionalities like real-time data processing and precise control, crucial for diagnostics and treatment.
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