XC3S250E-4FT256I
- Mfr.Part #
- XC3S250E-4FT256I
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 172 I/O 256FTBGA
- Stock
- 1,231
- In Stock :
- 1,231
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Factory Lead Time :
- 10 Weeks
- Combinatorial Delay of a CLB-Max :
- 0.76 ns
- Terminal Form :
- Ball
- Number of Registers :
- 4896
- Terminal Position :
- BOTTOM
- Time@Peak Reflow Temperature-Max (s) :
- 30
- RAM Size :
- 27kB
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of Terminations :
- 256
- Series :
- Spartan®-3E
- Number of Outputs :
- 132
- Total RAM Bits :
- 221184
- RoHS Status :
- Non-RoHS Compliant
- Number of Gates :
- 250000
- Number of Pins :
- 256
- Number of CLBs :
- 612
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel) :
- 240
- Mount :
- Surface Mount
- Mounting Type :
- Surface Mount
- Height Seated (Max) :
- 1.55mm
- Width :
- 17mm
- Supply Voltage :
- 1.2V
- Packaging :
- Tray
- Voltage - Supply :
- 1.14V~1.26V
- Number of I/O :
- 172
- Terminal Pitch :
- 1mm
- Power Supplies :
- 1.21.2/3.32.5V
- Qualification Status :
- Not Qualified
- Number of LABs/CLBs :
- 612
- Package / Case :
- 256-LBGA
- Length :
- 17mm
- Operating Supply Voltage :
- 1.2V
- Number of Logic Elements/Cells :
- 5508
- Speed Grade :
- 4
- Base Part Number :
- XC3S250E
- Clock Frequency :
- 572MHz
- Pbfree Code :
- No
- ECCN Code :
- EAR99
- Operating Temperature :
- -40°C~100°C TJ
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- JESD-609 Code :
- e0
- Pin Count :
- 256
- Published :
- 2012
- Datasheets
- XC3S250E-4FT256I

FPGAs AMD Xilinx XC3S250E-4FT256I Overview
The AMD Xilinx XC3S250E-4FT256I FPGA offers a versatile, high-performance solution for complex digital circuit design and system-level integration. Ideal for designers seeking flexibility and scalability, this FPGA features a robust 256FTBGA package, making it suitable for compact and high-density applications. With 172 user I/Os, it allows for extensive connectivity and interfacing options, supporting a wide range of digital communication standards. This product stands out in the market for its balance of cost, performance, and power efficiency, making it a top choice for businesses aiming to enhance their systems while keeping overhead low.
XC3S250E-4FT256I Features
This particular model of FPGA is crafted to deliver superior performance and efficiency. The 256FTBGA packaging not only ensures a compact footprint but also enhances the thermal management capabilities of the device. With 172 I/O ports, it facilitates complex and multi-faceted system designs. The integrated features are designed for optimal configuration and scalability, providing designers with the tools necessary to tackle various application demands effortlessly.
XC3S250E-4FT256I Applications
- Automotive Systems: Utilized in driver assistance systems where high-speed signal processing is essential.
- Consumer Electronics: Acts as a central processing unit in smart devices, managing multiple user interface elements and connectivity modules efficiently.
- Industrial Automation: Employs in control systems, where robustness and reliability are required to manage complex operations and data flow.
- Telecommunications: Supports infrastructure by facilitating rapid data transmission and signal processing capabilities, crucial for network reliability and efficiency.
- Medical Devices: Used in diagnostic equipment, where precise and reliable processing of biomedical signals is critical.
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