XC3S2000-5FGG456C

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Mfr.Part #
XC3S2000-5FGG456C
Manufacturer
AMD Xilinx
Package / Case
456-BBGA
Datasheet
Download
Description
IC FPGA 333 I/O 456FBGA
Stock
23
In Stock :
23

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Gates :
2000000
Operating Temperature :
0°C~85°C TJ
Number of Logic Elements/Cells :
46080
Operating Supply Voltage :
1.2V
Qualification Status :
Not Qualified
Supply Voltage :
1.2V
Mount :
Surface Mount
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Length :
23mm
Terminal Position :
BOTTOM
Voltage - Supply :
1.14V~1.26V
RAM Size :
90kB
Number of Outputs :
333
JESD-609 Code :
e1
Package / Case :
456-BBGA
Number of I/O :
333
Number of LABs/CLBs :
5120
Series :
Spartan®-3
Total RAM Bits :
737280
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Time@Peak Reflow Temperature-Max (s) :
30
Mounting Type :
Surface Mount
Peak Reflow Temperature (Cel) :
250
Factory Lead Time :
10 Weeks
Number of Terminations :
456
Pbfree Code :
yes
Terminal Form :
Ball
Speed Grade :
5
Packaging :
Tray
RoHS Status :
ROHS3 Compliant
ECCN Code :
3A991.D
Terminal Pitch :
1mm
Number of Pins :
456
Height Seated (Max) :
2.6mm
Pin Count :
456
Base Part Number :
XC3S2000
Published :
2009
Width :
23mm
Datasheets
XC3S2000-5FGG456C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S2000-5FGG456C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Package / Case:456-BBGA, Mounting Type:Surface Mount, Number of Terminations:456, Number of Pins:456, Base Part Number:XC3S2000, XC3S2000-5FGG456C pinout, XC3S2000-5FGG456C datasheet PDF, XC3S2000-5FGG456C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S2000-5FGG456C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S2000-5FGG456C


FPGAs AMD Xilinx XC3S2000-5FGG456C Overview

Introducing the AMD Xilinx XC3S2000-5FGG456C, a state-of-the-art Field Programmable Gate Array (FPGA) that embodies a blend of high performance, flexibility, and integration suited for sophisticated digital processing needs. This device is tailored for designers who demand high I/O interfacing and substantial logic capacity. Manufactured by the industry-leading AMD Xilinx, the XC3S2000-5FGG456C leverages advanced technology to deliver unparalleled functionality that supports complex, next-generation applications. Its design efficiency and scalability make it an ideal choice for high-volume productions across various industries.

XC3S2000-5FGG456C Features

The XC3S2000-5FGG456C FPGA offers a comprehensive feature set that includes 333 I/O pins, packaged in a compact 456FBGA format. It supports a wide range of standard and advanced communication protocols, ensuring high levels of data transfer and signal integrity. Additionally, its robust configuration options facilitate customizable integration, allowing engineers to tailor solutions specific to their application requirements.

XC3S2000-5FGG456C Applications

  • Telecommunications: Utilized in infrastructure such as routers and switches, enabling high-speed data transmission and advanced signal processing.
  • Aerospace and Defense: Critical in systems requiring high levels of reliability and programmability, such as satellite communications and avionic controls.
  • Automotive: Employs sophisticated driver assistance systems (ADAS) by processing inputs from multiple sensors for real-time decision making.
  • Consumer Electronics: Drives the development of feature-rich multimedia products such as high-definition video processing devices and virtual reality systems.
  • Industrial Automation: Key component in control systems, improving operational efficiency and precision in complex machinery and robotic systems.
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