XC3S2000-4FGG676C
- Mfr.Part #
- XC3S2000-4FGG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BGA
- Datasheet
- Download
- Description
- IC FPGA 489 I/O 676FBGA
- Stock
- 1,229
- In Stock :
- 1,229
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- ECCN Code :
- 3A991.D
- Mounting Type :
- Surface Mount
- Peak Reflow Temperature (Cel) :
- 250
- Supply Voltage :
- 1.2V
- Height Seated (Max) :
- 2.6mm
- Clock Frequency :
- 630MHz
- Width :
- 27mm
- Pbfree Code :
- yes
- Number of LABs/CLBs :
- 5120
- Number of Outputs :
- 489
- Terminal Position :
- BOTTOM
- Packaging :
- Tray
- RoHS Status :
- ROHS3 Compliant
- Voltage - Supply :
- 1.14V~1.26V
- Number of Pins :
- 676
- JESD-609 Code :
- e1
- Power Supplies :
- 1.21.2/3.32.5V
- Speed Grade :
- 4
- RAM Size :
- 90kB
- Terminal Form :
- Ball
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Package / Case :
- 676-BGA
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Series :
- Spartan®-3
- Operating Temperature :
- 0°C~85°C TJ
- Base Part Number :
- XC3S2000
- Number of I/O :
- 489
- Number of Gates :
- 2000000
- Factory Lead Time :
- 10 Weeks
- Length :
- 27mm
- Mount :
- Surface Mount
- Pin Count :
- 676
- Terminal Pitch :
- 1mm
- Number of Terminations :
- 676
- Total RAM Bits :
- 737280
- Operating Supply Voltage :
- 1.2V
- Published :
- 2009
- Number of Logic Elements/Cells :
- 46080
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Qualification Status :
- Not Qualified
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Datasheets
- XC3S2000-4FGG676C
FPGAs AMD Xilinx XC3S2000-4FGG676C Overview
The FPGAs AMD Xilinx XC3S2000-4FGG676C is a high-performance Field Programmable Gate Array designed by AMD Xilinx, renowned for its advanced integrated circuits. This FPGA features 489 I/O pins housed in a 676FBGA package, providing robust versatility for complex digital circuits. Tailored for demanding applications, the XC3S2000-4FGG676C supports a wide array of digital and mixed-signal applications. This product stands out in the market due to its ability to facilitate rapid prototyping and production scaling, essential for B2B customers looking to efficiently advance their product development cycles.
XC3S2000-4FGG676C Features
The XC3S2000-4FGG676C from AMD Xilinx offers numerous features that make it a powerful choice for developers and engineers. Notable features include its large number of Input/Output pins, high-density ball grid array packaging, and compatibility with multi-voltage systems. Its programmability allows for on-the-fly adjustments and updates, critical for applications requiring long-term viability and adaptability.
XC3S2000-4FGG676C Applications
- Telecommunications Equipment: Utilized in routers and switches, the XC3S2000-4FGG676C manages multiple data streams and high-speed signal processing, optimizing network efficiency and reliability.
- Automotive Systems: Supports advanced driver-assistance systems (ADAS) by processing inputs from multiple sensors for real-time decision-making, enhancing vehicle safety and performance.
- Consumer Electronics: Empowers smart home devices and entertainment systems, allowing for complex user interfaces and connectivity solutions tailored to user demands.
- Industrial Automation: Ideal for control systems in manufacturing processes, this FPGA can handle intricate algorithms for machinery control, improving precision and productivity.
- Medical Devices: Used in medical imaging systems, the XC3S2000-4FGG676C assists in the processing of large data volumes from diagnostic equipment, ensuring swift and accurate patient diagnostics.
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