XC3S2000-4FG900I
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- Mfr.Part #
- XC3S2000-4FG900I
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 565 I/O 900FBGA
- Stock
- 42,782
- In Stock ：
- 42,782
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Peak Reflow Temperature (Cel) :
- 225
- Total RAM Bits :
- 737280
- Factory Lead Time :
- 10 Weeks
- JESD-30 Code :
- S-PBGA-B900
- Speed Grade :
- 4
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- ECCN Code :
- 3A991.D
- Width :
- 31mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Surface Mount :
- yes
- RoHS Status :
- Non-RoHS Compliant
- Packaging :
- Bulk
- Supply Voltage :
- 1.2V
- JESD-609 Code :
- e0
- Package / Case :
- 900-BBGA
- Terminal Position :
- BOTTOM
- RAM Size :
- 90kB
- Power Supplies :
- 1.21.2/3.32.5V
- Series :
- Spartan®-3
- Number of Outputs :
- 565
- Qualification Status :
- Not Qualified
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Gates :
- 2000000
- Reach Compliance Code :
- not_compliant
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of I/O :
- 565
- Pbfree Code :
- No
- Terminal Form :
- Ball
- Pin Count :
- 900
- Height Seated (Max) :
- 2.6mm
- Terminal Pitch :
- 1mm
- Length :
- 31mm
- Number of Logic Elements/Cells :
- 46080
- Clock Frequency :
- 630MHz
- Number of Inputs :
- 565
- Operating Temperature :
- -40°C~100°C TJ
- Mounting Type :
- Surface Mount
- Operating Supply Voltage :
- 1.2V
- Number of LABs/CLBs :
- 5120
- Number of Terminations :
- 900
- Published :
- 2009
- Voltage - Supply :
- 1.14V~1.26V
- Datasheets
- XC3S2000-4FG900I
FPGAs AMD Xilinx XC3S2000-4FG900I Overview
The FPGAs AMD Xilinx XC3S2000-4FG900I is a high-performance, field-programmable gate array that delivers advanced integration capabilities in a compact 900FBGA package. Designed to meet the demanding requirements of modern digital circuits, this IC FPGA by AMD Xilinx features 565 I/O pins, providing ample flexibility for various high-speed interfaces and peripheral connections. Ideal for applications that require rapid prototyping and custom configurations, this product enables engineers to develop and iterate complex designs with reduced time-to-market and lower development costs. With its robust feature set and superior design flexibility, the XC3S2000-4FG900I is perfectly suited for industries looking to innovate and optimize their electronic solutions.
XC3S2000-4FG900I Features
This FPGA unit boasts a variety of features that make it a top choice for developers and engineers. Key attributes include a dense 900-pin ball grid array (BGA) packaging that ensures a compact footprint while allowing for a high degree of connectivity and functionality. The device supports a wide range of I/O standards, enhancing its adaptability across different hardware contexts. Additionally, its high-performance logic capabilities enable efficient processing and manipulation of complex digital data, ensuring applications run smoothly and reliably.
XC3S2000-4FG900I Applications
- Telecommunications: In telecom systems, the XC3S2000-4FG900I can be used for signal processing and data transport layers, improving bandwidth efficiency and reducing latency.
- Automotive: Suitable for use in driver assistance systems, this FPGA can manage sensor data integration and real-time critical decision-making processes, enhancing vehicle safety and performance.
- Consumer Electronics: This FPGA is ideal for high-resolution video processing applications in devices such as digital cameras and smart TVs, ensuring smooth video rendering and sharp image quality.
- Industrial: In industrial applications, the XC3S2000-4FG900I facilitates the management of robotic controls and automation systems, optimizing operational efficiency and reliability.
- Aerospace: Used in flight control systems, this FPGA helps in the processing and execution of complex algorithms that are critical for flight stability and instrumentation.
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