XC3S1600E-4FGG400C

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Mfr.Part #
XC3S1600E-4FGG400C
Manufacturer
AMD Xilinx
Package / Case
400-BGA
Datasheet
Download
Description
IC FPGA 304 I/O 400FBGA
Stock
540
In Stock :
540

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Speed Grade :
4
Packaging :
Tray
Peak Reflow Temperature (Cel) :
250
RAM Size :
81kB
Power Supplies :
1.21.2/3.32.5V
Qualification Status :
Not Qualified
Terminal Position :
BOTTOM
Total RAM Bits :
663552
Pbfree Code :
yes
Length :
21mm
Supply Voltage :
1.2V
Number of Outputs :
232
Published :
2007
Base Part Number :
XC3S1600E
Number of Pins :
400
Terminal Pitch :
1mm
Mounting Type :
Surface Mount
JESD-609 Code :
e1
Series :
Spartan®-3E
Number of Logic Elements/Cells :
33192
Operating Supply Voltage :
1.2V
Number of Registers :
29504
Number of I/O :
304
RoHS Status :
ROHS3 Compliant
Terminal Form :
Ball
Lead Free :
Lead Free
Number of Gates :
1600000
Clock Frequency :
572MHz
Time@Peak Reflow Temperature-Max (s) :
30
Pin Count :
400
Width :
21mm
Mount :
Surface Mount
Voltage - Supply :
1.14V~1.26V
Package / Case :
400-BGA
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Operating Temperature :
0°C~85°C TJ
Factory Lead Time :
10 Weeks
Number of LABs/CLBs :
3688
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Terminations :
400
Combinatorial Delay of a CLB-Max :
0.76 ns
ECCN Code :
3A991.D
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1600E-4FGG400C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC3S1600E, Number of Pins:400, Mounting Type:Surface Mount, Package / Case:400-BGA, Operating Temperature:0°C~85°C TJ, Number of Terminations:400, XC3S1600E-4FGG400C pinout, XC3S1600E-4FGG400C datasheet PDF, XC3S1600E-4FGG400C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1600E-4FGG400C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S1600E-4FGG400C


FPGAs AMD Xilinx XC3S1600E-4FGG400C Overview

The FPGAs AMD Xilinx XC3S1600E-4FGG400C is a highly capable field-programmable gate array (FPGA) designed for advanced applications requiring flexible, high-speed digital circuitry. Manufactured by AMD Xilinx, a leader in digital circuit technology, this FPGA integrates 304 input/output pins housed in a compact 400-ball fine-pitch ball grid array (FBGA) package. It is specifically engineered to support a range of demanding applications, from digital signal processing to complex logic operations, providing developers with a robust platform to build sophisticated systems on a chip (SoC).

XC3S1600E-4FGG400C Features

This FPGA model offers a rich set of features that make it ideal for a wide variety of uses. These include a large number of programmable logic cells, support for high-speed serial connectivity, and a flexible architecture that allows for the implementation of custom digital interfaces and protocols. Its advanced security features ensure safe and reliable operation, making it a top choice for designers looking for high performance and scalability.

XC3S1600E-4FGG400C Applications

  • Telecommunications: This FPGA can be used in routers and switches to manage data flow efficiently across networks, enhancing the speed and reliability of telecommunications infrastructure.
  • Automotive: Suitable for automotive applications such as advanced driver-assistance systems (ADAS), where high-speed data processing and reliability are crucial.
  • Industrial Automation: Ideal for controlling machinery in automated production lines, providing precise control and adaptability to complex industrial processes.
  • Consumer Electronics: Used in devices such as high-definition television (HDTV) receivers and gaming consoles, offering significant improvements in both performance and energy efficiency.
  • Aerospace and Defense: Applicable in satellite communications and avionic control systems, where its high reliability and resistance to harsh environments are essential.
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