XC3S1600E-4FG484C
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- Mfr.Part #
- XC3S1600E-4FG484C
- Manufacturer
- AMD Xilinx
- Package / Case
- 484-BBGA
- Datasheet
- Download
- Description
- IC FPGA 376 I/O 484FBGA
- Stock
- 47,524
- In Stock ：
- 47,524
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- ECCN Code :
- 3A991.D
- RAM Size :
- 81kB
- Series :
- Spartan®-3E
- Package / Case :
- 484-BBGA
- Published :
- 2008
- Total RAM Bits :
- 663552
- Number of Logic Elements/Cells :
- 33192
- Power Supplies :
- 1.21.2/3.32.5V
- Terminal Position :
- BOTTOM
- Pbfree Code :
- No
- Clock Frequency :
- 572MHz
- Packaging :
- Bulk
- Mounting Type :
- Surface Mount
- Number of LABs/CLBs :
- 3688
- Pin Count :
- 484
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Qualification Status :
- Not Qualified
- Terminal Form :
- Ball
- Number of Inputs :
- 376
- Number of I/O :
- 376
- Width :
- 23mm
- Number of Registers :
- 29504
- Terminal Pitch :
- 1mm
- Number of Outputs :
- 294
- Number of Terminations :
- 484
- JESD-609 Code :
- e0
- Peak Reflow Temperature (Cel) :
- 225
- Combinatorial Delay of a CLB-Max :
- 0.76 ns
- Supply Voltage :
- 1.2V
- Surface Mount :
- yes
- Height Seated (Max) :
- 2.6mm
- Operating Supply Voltage :
- 1.2V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- RoHS Status :
- Non-RoHS Compliant
- Length :
- 23mm
- Voltage - Supply :
- 1.14V~1.26V
- Speed Grade :
- 4
- Number of Gates :
- 1600000
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Operating Temperature :
- -40°C~100°C TJ
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Factory Lead Time :
- 10 Weeks
- Datasheets
- XC3S1600E-4FG484C
FPGAs AMD Xilinx XC3S1600E-4FG484C Overview
The AMD Xilinx XC3S1600E-4FG484C is a highly capable Field Programmable Gate Array (FPGA) that offers a robust solution for demanding digital applications. Designed to deliver superior performance and flexibility, this FPGA is ideal for developers looking to push the boundaries of hardware acceleration, signal processing, and complex logic implementation. With its extensive I/O capabilities and a compact 484-ball fine pitch BGA package, it integrates seamlessly into a wide range of applications, from advanced computing systems to industrial devices. Leveraging AMD Xilinx's technology, the XC3S1600E-4FG484C facilitates rapid prototyping and mass production scaling, making it a preferred choice for innovative projects requiring high-speed data processing and real-time performance.
XC3S1600E-4FG484C Features
This FPGA model features 376 I/O pins which provide ample flexibility for various connectivity options. The device operates efficiently with a system gate density suitable for complex designs and supports a range of voltages, ensuring compatibility with existing systems. Additionally, its robust architecture allows for superior heat dissipation and reliability under continuous operation, which is crucial for industrial and commercial applications that demand longevity and stability.
XC3S1600E-4FG484C Applications
- Data Processing Units: The high I/O count and processing power enable it to manage large streams of data, making it suitable for high-performance computing tasks.
- Telecommunications Infrastructure: Utilized in communication hardware for signal processing and data transmission, enhancing bandwidth and reducing latency.
- Automotive Applications: Can be integrated into automotive systems for real-time processing and control, such as advanced driver-assistance systems (ADAS).
- Industrial Automation: Its ability to rapidly process inputs and outputs makes it ideal for control systems in manufacturing environments, improving operational efficiency.
- Consumer Electronics: Used in devices requiring complex user interfaces and multimedia processing, such as smart TVs and gaming consoles.
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