XC3S1500-4FG676I

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Mfr.Part #
XC3S1500-4FG676I
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 487 I/O 676FCBGA
Stock
1,508
In Stock :
1,508

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Mount :
Surface Mount
Series :
Spartan®-3
JESD-609 Code :
e0
Voltage - Supply :
1.14V~1.26V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Height Seated (Max) :
2.6mm
Terminal Finish :
Tin/Lead (Sn63Pb37)
Combinatorial Delay of a CLB-Max :
0.61 ns
Factory Lead Time :
10 Weeks
Terminal Pitch :
1mm
Operating Supply Voltage :
1.2V
Operating Temperature :
-40°C~100°C TJ
Base Part Number :
XC3S1500
Number of Pins :
676
Number of Terminations :
676
Supply Voltage :
1.2V
Qualification Status :
Not Qualified
Mounting Type :
Surface Mount
Total RAM Bits :
589824
ECCN Code :
3A991.D
Pin Count :
676
Number of Logic Elements/Cells :
29952
Clock Frequency :
630MHz
Time@Peak Reflow Temperature-Max (s) :
30
Number of LABs/CLBs :
3328
Published :
2005
Number of Gates :
1500000
Speed Grade :
4
Peak Reflow Temperature (Cel) :
225
Terminal Position :
BOTTOM
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Width :
27mm
Package / Case :
676-BBGA, FCBGA
RoHS Status :
Non-RoHS Compliant
RAM Size :
72kB
Packaging :
Tray
Number of Outputs :
487
Terminal Form :
Ball
Pbfree Code :
No
Length :
27mm
Number of I/O :
487
Power Supplies :
1.21.2/3.32.5V
Datasheets
XC3S1500-4FG676I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1500-4FG676I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Base Part Number:XC3S1500, Number of Pins:676, Number of Terminations:676, Mounting Type:Surface Mount, Package / Case:676-BBGA, FCBGA, XC3S1500-4FG676I pinout, XC3S1500-4FG676I datasheet PDF, XC3S1500-4FG676I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1500-4FG676I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S1500-4FG676I


FPGAs AMD Xilinx XC3S1500-4FG676I Overview

Introducing the AMD Xilinx XC3S1500-4FG676I, a high-performance Field Programmable Gate Array (FPGA) that combines versatility with robust functionality, tailored for advanced digital processing needs. This IC FPGA, packaged in a compact 676-pin FCBGA (Flip Chip Ball Grid Array), offers a flexible solution for designers looking to leverage speed and integration. The XC3S1500-4FG676I is engineered to handle complex algorithms and multitasking environments, making it a key component in the development of cutting-edge technology and devices. Its ability to be programmed and re-programmed post-manufacture adds immense value, enabling custom configuration for specific applications and iterative updates in commercial and industrial settings.

XC3S1500-4FG676I Features

The XC3S1500-4FG676I from AMD Xilinx features 487 programmable I/O pins, providing vast options for interfacing and connectivity. The FPGA's robust architecture supports a wide array of logic operations and configurations, making it an ideal choice for projects requiring high-speed data processing and precise control. Additionally, its high pin count and adaptable nature ensure compatibility with multiple peripherals and systems, enhancing both its flexibility and scalability in complex electronic designs.

XC3S1500-4FG676I Applications

  • Telecommunications Infrastructure: Utilized in routers, switches, and network bridges to enhance signal integrity and data flow management, optimizing communication networks.
  • Aerospace and Defense Systems: Employs in navigation systems and onboard computers, providing reliable processing capabilities essential for mission-critical applications.
  • Automotive Electronics: Integrated into driver assistance systems to process real-time data from sensors, improving vehicle safety and performance.
  • Industrial Automation: Applied in machine control units for automating complex tasks, enhancing efficiency and precision in manufacturing processes.
  • Consumer Electronics: Powers high-definition multimedia interfaces and virtual reality systems, delivering superior user experiences through enhanced graphical processing.
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