XC3S1400A-5FGG676C

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Mfr.Part #
XC3S1400A-5FGG676C
Manufacturer
AMD Xilinx
Package / Case
676-BGA
Datasheet
Download
Description
IC FPGA 502 I/O 676FBGA
Stock
4
In Stock :
4

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Total RAM Bits :
589824
Pbfree Code :
yes
Height Seated (Max) :
2.44mm
RAM Size :
72kB
Time@Peak Reflow Temperature-Max (s) :
30
Length :
27mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Logic Elements/Cells :
25344
Mounting Type :
Surface Mount
Number of I/O :
502
Qualification Status :
Not Qualified
Number of LABs/CLBs :
2816
RoHS Status :
ROHS3 Compliant
ECCN Code :
3A991.D
Clock Frequency :
770MHz
Published :
2007
JESD-609 Code :
e1
Number of Gates :
1400000
Packaging :
Tray
Width :
27mm
Operating Supply Voltage :
1.2V
Combinatorial Delay of a CLB-Max :
0.62 ns
Series :
Spartan®-3A
Peak Reflow Temperature (Cel) :
250
Speed Grade :
5
Number of Outputs :
408
Factory Lead Time :
10 Weeks
Terminal Pitch :
1mm
Terminal Form :
Ball
Supply Voltage :
1.2V
Base Part Number :
XC3S1400A
Terminal Position :
BOTTOM
Voltage - Supply :
1.14V~1.26V
Mount :
Surface Mount
Pin Count :
676
Number of Pins :
676
Operating Temperature :
0°C~85°C TJ
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Package / Case :
676-BGA
Number of Terminations :
676
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1400A-5FGG676C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Base Part Number:XC3S1400A, Number of Pins:676, Operating Temperature:0°C~85°C TJ, Package / Case:676-BGA, Number of Terminations:676, XC3S1400A-5FGG676C pinout, XC3S1400A-5FGG676C datasheet PDF, XC3S1400A-5FGG676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1400A-5FGG676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S1400A-5FGG676C


FPGAs AMD Xilinx XC3S1400A-5FGG676C Overview

The FPGAs AMD Xilinx XC3S1400A-5FGG676C is a highly versatile and powerful integrated circuit designed for applications that require high-speed, flexible logic solutions. Manufactured by AMD Xilinx, this FPGA offers an optimal balance between performance and power efficiency, making it an excellent choice for developers looking to push the boundaries of technology. With its robust 676-pin FBGA package and 502 I/O ports, the XC3S1400A-5FGG676C provides ample flexibility for a wide range of design configurations and is especially suited for high-volume, multi-functional devices in competitive markets.

XC3S1400A-5FGG676C Features

The XC3S1400A-5FGG676C FPGA is equipped with advanced features that make it a leading choice for industry professionals. Key attributes include a large number of input/output options, providing extensive connectivity and interfacing capabilities. The device also supports a variety of logic configuration options, which allows for highly customized designs tailored to specific application requirements. Additionally, its high-speed digital signal processing enhances computational capabilities, suitable for complex algorithms and data-intensive tasks.

XC3S1400A-5FGG676C Applications

  • Telecommunications: Utilized in network infrastructure for signal processing and data management, enhancing bandwidth and reducing latency.
  • Automotive: Integrated into driver assistance systems for real-time sensor data processing, improving safety and vehicle dynamics.
  • Consumer Electronics: Employed in high-performance gaming consoles and home entertainment systems to manage audio and video processing for enhanced user experiences.
  • Industrial: Used in automation systems for controlling machinery and processes, increasing efficiency and reliability in production environments.
  • Aerospace: Critical for satellite communications and avionics, where robust and reliable data handling is essential for mission success.
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