XC3S1400A-4FT256I

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Mfr.Part #
XC3S1400A-4FT256I
Manufacturer
AMD Xilinx
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 161 I/O 256FTBGA
Stock
814
In Stock :
814

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Width :
17mm
Operating Supply Voltage :
1.2V
RoHS Status :
Non-RoHS Compliant
Number of I/O :
161
Length :
17mm
Speed Grade :
4
Packaging :
Tray
Mounting Type :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
30
JESD-609 Code :
e0
Number of Pins :
256
Height Seated (Max) :
1.55mm
Terminal Form :
Ball
Number of Logic Elements/Cells :
25344
Terminal Pitch :
1mm
Power Supplies :
1.21.2/3.33.3V
Total RAM Bits :
589824
Package / Case :
256-LBGA
RAM Size :
72kB
Qualification Status :
Not Qualified
Factory Lead Time :
10 Weeks
Number of Gates :
1400000
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Position :
BOTTOM
Base Part Number :
XC3S1400A
Peak Reflow Temperature (Cel) :
240
Pin Count :
256
Operating Temperature :
-40°C~100°C TJ
Series :
Spartan®-3A
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Supply Voltage :
1.2V
Terminal Finish :
Tin/Lead (Sn63Pb37)
Clock Frequency :
667MHz
Number of LABs/CLBs :
2816
Number of Outputs :
148
Mount :
Surface Mount
Number of Terminations :
256
ECCN Code :
EAR99
Combinatorial Delay of a CLB-Max :
0.71 ns
Voltage - Supply :
1.14V~1.26V
Published :
2007
Datasheets
XC3S1400A-4FT256I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1400A-4FT256I from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Pins:256, Package / Case:256-LBGA, Base Part Number:XC3S1400A, Operating Temperature:-40°C~100°C TJ, Number of Terminations:256, XC3S1400A-4FT256I pinout, XC3S1400A-4FT256I datasheet PDF, XC3S1400A-4FT256I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1400A-4FT256I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S1400A-4FT256I


FPGAs AMD Xilinx XC3S1400A-4FT256I Overview

The FPGAs AMD Xilinx XC3S1400A-4FT256I is a high-performance, field-programmable gate array designed for advanced embedded systems. Engineered by AMD Xilinx, this IC FPGA is packaged in a 256FTBGA format, supporting 161 I/O pins, making it highly versatile for a range of applications. This component is specifically tailored for environments requiring high-speed digital processing and robust data management. With its inherent flexibility and configurability, the XC3S1400A-4FT256I offers an excellent solution for designers looking to develop complex digital circuits with the possibility of post-deployment reconfiguration, ensuring long-term utility and adaptability in rapidly evolving technological landscapes.

XC3S1400A-4FT256I Features

This FPGA from AMD Xilinx stands out with its robust feature set that includes a high I/O pin count, a compact 256FTBGA package, and enhanced performance capabilities suitable for demanding digital environments. The XC3S1400A-4FT256I facilitates complex digital processing tasks, supports extensive logic operations, and provides a scalable architecture, making it an ideal choice for both prototyping and full-scale production.

XC3S1400A-4FT256I Applications

  • Telecommunications Equipment: Utilized in routers and switches for data packet processing, signal integrity maintenance, and network traffic management.
  • Automotive Systems: Plays a crucial role in driver assistance systems (ADAS), infotainment, and vehicular control systems by handling complex computations and real-time processing.
  • Consumer Electronics: Integral to the development of high-definition multimedia interfaces (HDMI), gaming consoles, and smart home devices, where flexibility and high-speed processing are essential.
  • Industrial Automation: Used in control systems, robotic arms, and machine vision, providing the necessary processing power and configurability for precise operations and enhancements.
  • Aerospace and Defense: Deployed in satellite communications, avionics, and military hardware for its robustness and capability to perform in extreme conditions and handle complex algorithms.
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