XC3S1400A-4FGG676I
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- Mfr.Part #
- XC3S1400A-4FGG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BGA
- Datasheet
- Download
- Description
- IC FPGA 502 I/O 676FBGA
- Stock
- 1,771
- In Stock ：
- 1,771
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Voltage - Supply :
- 1.14V~1.26V
- Base Part Number :
- XC3S1400A
- Terminal Pitch :
- 1mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of LABs/CLBs :
- 2816
- Power Supplies :
- 1.22.5/3.3V
- Number of Gates :
- 1400000
- Length :
- 27mm
- Total RAM Bits :
- 589824
- Width :
- 27mm
- Speed Grade :
- 4
- Number of Terminations :
- 676
- JESD-609 Code :
- e1
- Qualification Status :
- Not Qualified
- Terminal Position :
- BOTTOM
- Packaging :
- Tray
- Number of Logic Elements/Cells :
- 25344
- Combinatorial Delay of a CLB-Max :
- 0.71 ns
- Number of Pins :
- 676
- ECCN Code :
- 3A991.D
- Mount :
- Surface Mount
- Package / Case :
- 676-BGA
- Pin Count :
- 676
- Clock Frequency :
- 667MHz
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of I/O :
- 502
- Number of Outputs :
- 408
- Terminal Form :
- Ball
- Peak Reflow Temperature (Cel) :
- 250
- REACH SVHC :
- Unknown
- Series :
- Spartan®-3A
- Factory Lead Time :
- 10 Weeks
- Published :
- 2007
- Operating Supply Voltage :
- 1.2V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Operating Temperature :
- -40°C~100°C TJ
- Supply Voltage :
- 1.2V
- Mounting Type :
- Surface Mount
- Pbfree Code :
- yes
- RoHS Status :
- ROHS3 Compliant
- RAM Size :
- 72kB
- Datasheets
- XC3S1400A-4FGG676I
FPGAs AMD Xilinx XC3S1400A-4FGG676I Overview
The FPGAs AMD Xilinx XC3S1400A-4FGG676I is a highly capable integrated circuit designed for applications requiring high-speed, flexible logic solutions. Manufactured by the renowned AMD Xilinx, this FPGA is housed in a 676FBGA package and boasts an impressive array of 502 I/O pins, making it highly adaptable for complex digital environments. This product is engineered to support a wide range of applications, offering designers the flexibility to implement configurations tailored to their specific needs, all while maintaining a robust and reliable operation. The XC3S1400A-4FGG676I excels in delivering high-performance computing power necessary for intensive processing tasks, ensuring efficient and effective execution of applications.
XC3S1400A-4FGG676I Features
This FPGA features a robust architecture that can handle multiple inputs and outputs with ease, supporting a wide variety of digital and analog functionalities. Its large number of I/O pins allows for extensive connectivity options, which is crucial for systems requiring numerous simultaneous connections without sacrificing performance. The chip is also designed for enhanced thermal management, making it ideal for use in environments where reliability is as crucial as performance. Enhanced security features ensure that sensitive data handled by the FPGA remains protected against potential threats, thus making it a trusted choice for critical applications.
XC3S1400A-4FGG676I Applications
- Telecommunications: Utilized in communications infrastructure to manage signal processing and data flow efficiently, enhancing network reliability and speed.
- Automotive Systems: Employed in advanced driver-assistance systems (ADAS) to process real-time data from sensors and cameras, aiding in decision-making and vehicle automation.
- Industrial Automation: Key component in control systems, helping to regulate and monitor industrial processes with high precision and reliability.
- Consumer Electronics: Integrated into devices such as high-definition televisions and gaming consoles, where it processes complex video and audio data to deliver enhanced user experiences.
- Medical Devices: Critical in the operation of diagnostic and imaging equipment, ensuring accurate data handling and real-time processing capabilities.
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